Securities, chip mounting product, and manufacturing method thereof

• US 7,857,229 B2
• Filed: 06/18/2009
• Issued: 12/28/2010
• Est. Priority Date: 12/26/2003
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kato, Kiyoshi, Yamazaki, Shunpei
• Primary Examiner(s): Frech; Karl D.
• Application Number:
  US12/486,838
• Publication Number:
  US 20090261173A1
• Time in Patent Office: 558 Days
• Field of Search: 235/492, 235/380, 235/451, 235/486, 257/679, 257/895, 343/895
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07767 the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
• CPC Class Codes: G07D 7/01 Testing electronic circuits therein
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In view of the foregoing, an integrated circuit having a semiconductor film with a thickness of 0.2 μm or less is mounted on securities including bills, belongings, containers of food and drink, and the like (hereinafter referred to as products and the like). The ID chip of the invention can be reduced in cost and increased in impact resistance as compared with a chip formed over a silicon wafer while maintaining an attractive design.

Claims

1. A semiconductor device comprising:

an integrated circuit including;

a memory cell including a semiconductor film;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film; and

an antenna,

wherein the integrated circuit is electrically connected to the antenna,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting, and

wherein data inputted to the integrated circuit is configured to be read by a portable electronic device comprising a reader.

2. The semiconductor device according to claim 1, wherein the memory cell is a non-volatile and non-rewritable memory cell.

3. The semiconductor device according to claim 2, wherein the non-volatile and non-rewritable memory cell stores another data based on variations in characteristics of the semiconductor film.

4. The semiconductor device according to claim 1, wherein the laser cutting is performed to input the data to the integrated circuit.

5. The semiconductor device according to claim 1,

wherein the integrated circuit is mounted to a product, and

wherein the data includes information about the product.

6. A semiconductor device comprising:

an integrated circuit including;

a thin film transistor;

a memory cell including a semiconductor film;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film; and

an antenna,

wherein the integrated circuit is electrically connected to the antenna,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting, and

wherein data inputted to the integrated circuit is configured to be read by a portable electronic device comprising a reader.

7. The semiconductor device according to claim 6, wherein the memory cell is a non-volatile and non-rewritable memory cell.

8. The semiconductor device according to claim 7, wherein the non-volatile and non-rewritable memory cell stores another data based on variations in characteristics of the semiconductor film.

9. The semiconductor device according to claim 6, wherein the laser cutting is performed to input the data to the integrated circuit.

10. The semiconductor device according to claim 6,

wherein the integrated circuit is mounted to a product, and

wherein the data includes information about the product.

11. The semiconductor device according to claim 6, wherein the thin film transistor includes the semiconductor film.

12. A system comprising:

an integrated circuit;

an antenna; and

a portable electronic device,

wherein the integrated circuit is electrically connected to the antenna,

wherein the integrated circuit comprising;

a memory cell including a semiconductor film;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting, and

wherein data inputted to the integrated circuit is configured to be read by the portable electronic device comprising a reader.

13. The system according to claim 12, wherein the memory cell is a non-volatile and non-rewritable memory cell.

14. The system according to claim 13, wherein the non-volatile and non-rewritable memory cell stores another data based on variations in characteristics of the semiconductor film.

15. The system according to claim 12, wherein the laser cutting is performed to input the data to the integrated circuit.

16. The system according to claim 12,

wherein the integrated circuit is mounted to a product, and

wherein the data includes information about the product.

17. The system according to claim 12,

wherein the portable electronic device further comprises a display portion configured to display the data.

18. A system comprising:

an integrated circuit;

an antenna; and

a portable electronic device,

wherein the integrated circuit is electrically connected to the antenna,

wherein the integrated circuit comprising;

a thin film transistor;

a memory cell including a semiconductor film;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting, and

wherein data inputted to the integrated circuit is configured to be read by the portable electronic device comprising a reader.

19. The system according to claim 18, wherein the memory cell is a non-volatile and non-rewritable memory cell.

20. The system according to claim 19, wherein the non-volatile and non-rewritable memory cell stores another data based on variations in characteristics of the semiconductor film.

21. The system according to claim 18, wherein the laser cutting is performed to input the data to the integrated circuit.

22. The system according to claim 18,

wherein the integrated circuit is mounted to a product, and

wherein the data includes information about the product.

23. The system according to claim 18, wherein the thin film transistor includes the semiconductor film.

24. The system according to claim 18,

wherein the portable electronic device further comprises a display portion configured to display the data.

25. A system comprising:

means for reading data inputted to an integrated circuit; and

means for displaying the data,

wherein the integrated circuit is electrically connected to an antenna,

wherein the integrated circuit comprises;

a thin film transistor;

a memory cell including a semiconductor film;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting.

26. The system according to claim 25, wherein the laser cutting is performed to input the data to the integrated circuit.

27. The system according to claim 25, wherein the memory cell is a non-volatile and non-rewritable memory cell.

28. The system according to claim 25, wherein the thin film transistor includes the semiconductor film.

29. The system according to claim 25, further comprising means for writing the data to the integrated circuit.

30. The system according to claim 25,

wherein the integrated circuit is mounted to a product, and

wherein the data includes information about the product.