Wireless IC device and manufacturing method thereof

• US 7,857,230 B2
• Filed: 10/15/2009
• Issued: 12/28/2010
• Est. Priority Date: 07/18/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ikemoto, Nobuo
• Primary Examiner(s): Labaze; Edwyn
• Application Number:
  US12/579,672
• Publication Number:
  US 20100038433A1
• Time in Patent Office: 439 Days
• Field of Search: 235/492, 235/380, 235/441, 235/451, 340/572.1
• US Class Current: 235/492
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 75/12 with the ends of the tube closed by flattening and heat-sealing
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

An electromagnetic coupling module includes a feed circuit substrate having external coupling electrodes on both main surfaces thereof and a wireless IC chip. Radiation electrodes are disposed on a packaging body. The electromagnetic coupling module is disposed on a joint of the packaging body so that the external coupling electrodes on both the main surfaces of the electromagnetic coupling module are coupled to the radiation electrodes, respectively. Thus, the wireless IC device is resistant to shock, stress, forces or the like, easy to manufacture, obtains stable characteristics and allows for easy reuse or replacement of an IC chip.

Claims

1. A wireless IC device comprising:

a wireless IC;

a radiation plate including a base material and a radiation electrode disposed on the base material;

a feed circuit substrate including an external coupling electrode and an inductance element, the external coupling electrode being electromagnetically coupled to the radiation electrode, the inductance element being coupled to the wireless IC; and

an electromagnetic coupling module defined by at least the wireless IC and the feed circuit substrate;

wherein

the radiation plate is disposed along each of opposed first and second main surfaces of the electromagnetic coupling module.

2. The wireless IC device according to claim 1, wherein

the feed circuit substrate includes a resonant circuit.

3. The wireless IC device according to claim 1, wherein

the feed circuit substrate includes a matching circuit.

4. The wireless IC device according to claim 1, wherein

the external coupling electrode is a flat electrode capacitively coupled to the radiation electrode, and the external coupling electrode is disposed near a main surface of the feed circuit substrate inside the feed circuit substrate.

5. The wireless IC device according to claim 1, wherein

the electromagnetic coupling module is disposed on one of a joint of ends of the radiation plate and a joint of a folded portion of the radiation plate.

6. The wireless IC device according to claim 5, wherein

the electromagnetic coupling module disposed on the joint is detachable from the joint.

7. The wireless IC device according to claim 1, wherein

the electromagnetic coupling module is disposed on a joint of the different radiation plates.

8. The wireless IC device according to claim 1, wherein

the radiation electrode is disposed on an outer surface of the base material that is remote from the electromagnetic coupling module.

9. The wireless IC device according to claim 1, wherein

the electromagnetic coupling module is disposed inside the base material of the radiation plate.

10. The wireless IC device according to claim 1, wherein

one or both of the wireless IC and the feed circuit substrate are covered with a protection film.

11. The wireless IC device according to claim 1, wherein

the wireless IC is a wireless IC chip made of a semiconductor, the feed circuit substrate has a recess on a first main surface thereof, and the wireless IC chip is disposed in the recess.

12. The wireless IC device according to claim 1, wherein

the wireless IC chip is disposed inside the feed circuit substrate.

13. The wireless IC device according to claim 1, wherein

the feed circuit substrate is a multilayer substrate including laminated dielectric layers each having an electrode pattern disposed thereon.

14. A wireless IC device manufacturing method comprising the steps of:

preparing an electromagnetic coupling module and a base material, the electromagnetic coupling module being formed by providing an wireless IC on a feed circuit substrate, the feed circuit substrate including an inductance element, and forming a plurality of radiation electrodes on at least one main surface of the base material using a conductive material;

forming a substantially cylindrical or bag-shaped packaging material by joining together the base material at a joint, the joint being defined by portions near a pair of edges of the base material; and

affixing an electromagnetic coupling module to the joint of the base material, the electromagnetic coupling module being electromagnetically coupled to the radiation plates.