Systems and methods for integrated circuits comprising multiple body biasing domains
First Claim
1. A semiconductor device comprising:
- an epitaxy layer including;
a border region of a first conductivity type, wherein the border region extends to a first depth and forms a continuous structure around a first region; and
a buried region of the first conductivity type connected to the border region to form a bottom for the first region, wherein the buried region is located internally with respect to the epitaxy layer, wherein the border region and the buried region are configured to electrically isolate a first body biasing voltage of the first region from a second body biasing voltage of a second region; and
a substrate of a second conductivity type, wherein the epitaxy layer of the second conductivity type is formed on the substrate.
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Abstract
Systems and methods for integrated circuits comprising multiple body biasing domains. In accordance with a first embodiment of the present invention, a semiconductor structure comprises a substrate of first type material. A first closed structure comprising walls of second type material extends from a surface of the substrate to a first depth. A planar deep well of said second type material underlying and coupled to the closed structure extends from the first depth to a second depth. The closed structure and the planar deep well of said second type material form an electrically isolated region of the first type material. A second-type semiconductor device is disposed to receive a first body biasing voltage from the electrically isolated region of the first type material. A well of the second-type material within the electrically isolated region of the first type material is formed and a first-type semiconductor device is disposed to receive a second body biasing voltage from the well of second-type material.
163 Citations
23 Claims
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1. A semiconductor device comprising:
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an epitaxy layer including; a border region of a first conductivity type, wherein the border region extends to a first depth and forms a continuous structure around a first region; and a buried region of the first conductivity type connected to the border region to form a bottom for the first region, wherein the buried region is located internally with respect to the epitaxy layer, wherein the border region and the buried region are configured to electrically isolate a first body biasing voltage of the first region from a second body biasing voltage of a second region; and a substrate of a second conductivity type, wherein the epitaxy layer of the second conductivity type is formed on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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an epitaxy layer including; a first transistor of a first conductivity type; a second transistor of a second conductivity type; a border region of the first conductivity type, wherein the border region extends to a first depth and forms a continuous structure around a first region including the first and second transistors; and a buried region of the first conductivity type connected to the border region to form a bottom for the first region, wherein the buried region is located internally with respect to the epitaxy layer, wherein the border region and the buried region are configured to electrically isolate a first body biasing voltage of the first region from a second body biasing voltage of a second region; and a substrate of the second conductivity type, wherein the epitaxy layer of the second conductivity type is formed on the substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor device comprising:
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an epitaxy layer including; a first border region of a first conductivity type, wherein the first border region extends to a first depth and forms a first continuous structure around a first region; a first buried region of the first conductivity type connected to the first border region to form a bottom for the first region, wherein the first buried region is located internally with respect to the epitaxy layer; a second border region of the first conductivity type, wherein the second border region extends to a second depth and forms a second continuous structure around a second region; and a second buried region of the first conductivity type connected to the second border region to form a bottom for the second region, wherein the second buried region is located internally with respect to the epitaxy layer, wherein the first border region and the first buried region are configured to electrically isolate a first body biasing voltage of the first region from a second body biasing voltage of the second region, and wherein the second border region and the second buried region are configured to electrically isolate the second body biasing voltage of the second region from the first body biasing voltage of the first region; and a substrate of a second conductivity type, wherein the epitaxy layer of the second conductivity type is formed on the substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification