Method for protecting encapsulated sensor structures using stack packaging
First Claim
Patent Images
1. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
- fabricating the micro-mechanical sensor structure with a protective membrane arranged on, and to directly cover, the embedded micro-mechanical sensor structure;
arranging the micro-mechanical sensor chip directly onto a second chip so that the protective membrane faces toward the second chip; and
securing the micro-mechanical sensor chip to the second chip.
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Abstract
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
10 Citations
40 Claims
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1. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a protective membrane arranged on, and to directly cover, the embedded micro-mechanical sensor structure; arranging the micro-mechanical sensor chip directly onto a second chip so that the protective membrane faces toward the second chip; and securing the micro-mechanical sensor chip to the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; arranging the micro-mechanical sensor chip directly onto a face of a second chip that faces, and is parallel to, the face of the embedded micro-mechanical sensor structure, so that the protective membrane is arranged between the faces; arranging the micro-mechanical sensor chip and the second chip on a package frame to support the micro-mechanical sensor chip and the second chip in a single package; and applying a plastic mold to seal the micro-mechanical sensor chip and the second chip in the single package.
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18. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a protective membrane arranged on the embedded micro-mechanical sensor structure; arranging the micro-mechanical sensor chip onto a second chip so that the protective membrane faces toward the first chip; arranging at least one additional micro-mechanical sensor chip at least one of on, underneath, and between the micro-mechanical sensor chip and the second chip to provide a multi-sensor device. - View Dependent Claims (19, 20)
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21. A micro-mechanical sensor device, comprising:
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a first chip; a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; a package frame to support the first chip and the micro-mechanical sensor chip in a single package; and a plastic mold to seal the first chip and the micro-mechanical sensor chip in the single package; wherein the micro-mechanical sensor chip is arranged directly onto a face of the first chip that faces and is parallel to the face of the embedded micro-mechanical sensor structure so that the protective membrane is arranged between the faces. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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30. A micro-mechanical sensor device, comprising:
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a first chip; a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; an RF chip arranged on the micro-mechanical sensor chip for wireless communication; wherein the micro-mechanical sensor chip is arranged directly onto a face of the first chip that faces and is parallel to the face of the embedded micro-mechanical sensor structure so that the protective membrane is arranged between the faces. - View Dependent Claims (31)
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32. A micro-mechanical sensor device, comprising:
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a first chip; a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; a bond to secure the micro-mechanical sensor chip to the first chip; a package frame to support the first chip and the micro-mechanical sensor chip in a single package; and a plastic mold to seal the first chip and the micro-mechanical sensor chip in the single package; wherein; the micro-mechanical sensor chip is arranged directly onto a face of the first chip that faces and is parallel to the face of the embedded micro-mechanical sensor structure so that the protective membrane is arranged between the faces; and the protective membrane is configured at a reduced thickness. - View Dependent Claims (33)
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34. A micro-mechanical sensor device, comprising:
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a first chip; a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; a sealing bond ring to surround the embedded micro-mechanical structure; a package frame to support the first chip and the micro-mechanical sensor chip in a single package; and a plastic mold to seal the first chip and the micro-mechanical sensor chip in the single package; wherein; the micro-mechanical sensor chip is arranged directly onto a face of the first chip that faces and is parallel to the face of the embedded micro-mechanical sensor structure so that the protective membrane is arranged between the faces; and the protective membrane is at least partially absent.
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35. A Micro-mechanical sensor device, comprising:
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a first chip; and a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on the embedded micro-mechanical sensor structure, wherein; the micro-mechanical sensor chip is arranged directly onto the first chip so that the protective membrane faces toward the first chip; and the protective membrane is arranged to directly cover the embedded micro-mechanical sensor structure. - View Dependent Claims (36, 37, 38, 39)
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40. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a protective membrane arranged on a face of the embedded micro-mechanical sensor structure; arranging an RF chip on the micro-mechanical sensor chip for wireless communication; and arranging the micro-mechanical sensor chip directly onto a face of a second chip that faces, and is parallel to, the face of the embedded micro-mechanical sensor structure, so that the protective membrane is arranged between the faces.
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Specification