Method and system for a balun embedded in an integrated circuit package
First Claim
1. A method for wireless communication, the method comprising:
- processing received RF signals in an integrated circuit electrically coupled to a balun that is integrated in a multi-layer package, wherein;
said integrated circuit is bonded to said multi-layer package,said balun is enabled to process RF signals received from and/or communicated to an antenna,said balun comprises ferromagnetic layers integrated in said multi-layer package; and
said processing of said RF signals by said balun is bypassable via bypass switches integrated in said multi-layer package.
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Accused Products
Abstract
Methods and systems for a balun embedded in an integrated circuit package are disclosed and may include a multi-layer package bonded to an integrated circuit. The multi-layer package may include an integrated balun which may be enabled to process RF signals received from and/or communicated to an antenna. The integrated circuit may be flip-chip bonded to the multi-layer package. The balun may include ferromagnetic layers integrated in the multi-layer package, and may be bypassed via bypass switches integrated in the multi-layer package. The switches integrated in the multi-layer package may include MEMS switches. The balun may be bypassed via bypass switches in the integrated circuit. The switches in the integrated circuit may include CMOS switches. The balun may be impedance matched to the integrated circuit via surface mount devices, which may be coupled to the multi-layer package.
41 Citations
68 Claims
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1. A method for wireless communication, the method comprising:
processing received RF signals in an integrated circuit electrically coupled to a balun that is integrated in a multi-layer package, wherein; said integrated circuit is bonded to said multi-layer package, said balun is enabled to process RF signals received from and/or communicated to an antenna, said balun comprises ferromagnetic layers integrated in said multi-layer package; and said processing of said RF signals by said balun is bypassable via bypass switches integrated in said multi-layer package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said balun is enabled to process RF signals received from and/or communicated to an antenna; said balun comprises ferromagnetic layers integrated in said multi-layer package; and said processing of said RF signals by said balun is bypassable via bypass switches integrated in said multi-layer package. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method for wireless communication, the method comprising:
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processing received RF signals in an integrated circuit coupled to a balun integrated in a multi-layer package, wherein; said integrated circuit is bonded to said multi-layer package; said balun is enabled to process said received RF signals, which are received from and/or communicated to an antenna; and bypass switches integrated in said multi-layer package enable bypassing said processing of said received RF signals by said balun. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said balun is enabled to process RF signals received from and/or communicated to an antenna; and said integrated circuit bypasses said balun via bypass switches integrated in said multi-layer package. - View Dependent Claims (24, 25, 26, 27, 28)
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29. A method for wireless communication, the method comprising:
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processing received RF signals in an integrated circuit coupled to a balun integrated in a multi-layer package, wherein; said integrated circuit is bonded to said multi-layer package; said balun is enabled to process RF signals, which are received from and/or communicated to an antenna; and bypass switches integrated in said integrated circuit enable bypassing said processing of said processing of said received RF signals by said balun. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said integrated circuit bypasses said balun via bypass switches in said integrated circuit; and said balun is enabled to process RF signals received from and/or communicated to an antenna. - View Dependent Claims (36, 37, 38, 39, 40)
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41. A method for wireless communication, the method comprising:
in an integrated circuit, processing received RF signals by a balun integrated in a multi-layer package, wherein; said integrated circuit is bonded to said multi-layer package; said balun is enabled to process RF signals received from and/or communicated to an antenna; and said balun is impedance matched to said integrated circuit via surface mount devices. - View Dependent Claims (42, 43, 44, 45, 46)
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47. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said balun is enabled to process RF signals received from and/or communicated to an antenna; and said balun is impedance matched to said integrated circuit via surface mount devices. - View Dependent Claims (48, 49, 50, 51, 52)
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53. A method for wireless communication, the method comprising:
processing received RF signals in an integrated circuit coupled to a balun integrated in a multi-layer package, wherein; said integrated circuit is bonded to said multi-layer package; said balun is enabled to process RF signals received from and/or communicated to an antenna when said balun is not bypassed; said balun comprises ferromagnetic layers integrated in said multi-layer package; and said balun is bypassed via bypass switches in said integrated circuit. - View Dependent Claims (54, 55, 56, 57)
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58. A method for wireless communication, the method comprising:
processing received RF signals in an integrated circuit coupled to a balun integrated in a multi-layer package and impedance matching said balun to said integrated circuit via surface mount devices, wherein; said integrated circuit is bonded to said multi-layer package; said balun is enabled to process RF signals received from and/or communicated to an antenna; and said balun comprises ferromagnetic layers integrated in said multi-layer package. - View Dependent Claims (59, 60)
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61. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said balun is enabled to process RF signals received from and/or communicated to an antenna; said balun comprises ferromagnetic layers integrated in said multi-layer package; and said integrated circuit is enabled to bypass said balun via bypass switches in said integrated circuit. - View Dependent Claims (62, 63, 64, 65)
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66. A system for wireless communication, the system comprising:
a multi-layer package bonded to an integrated circuit, wherein; said multi-layer package comprises an integrated balun; said balun is enabled to process RF signals received from and/or communicated to an antenna; said balun comprises ferromagnetic layers integrated in said multi-layer package; and said balun is impedance matched to said integrated circuit via surface mount devices. - View Dependent Claims (67, 68)
Specification