Method and system for controlling MEMS switches in an integrated circuit package

• US 7,859,360 B2
• Filed: 12/13/2007
• Issued: 12/28/2010
• Est. Priority Date: 12/13/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Primary Examiner(s): Takaoka; Dean O
• Application Number:
  US11/956,125
• Publication Number:
  US 20090153265A1
• Time in Patent Office: 1,111 Days
• Field of Search: 333/101, 333/103, 333/104, 333/105, 333/262
• US Class Current: 333/105
• CPC Class Codes: H01P 1/127 Strip line switches

Abstract

Methods and systems for controlling MEMS switches in an integrated circuit package are disclosed and may include controlling one or more arrays of MEMS switches utilizing a control chip. The arrays of MEMS switches and one or more circuit components may be integrated in and/or on a multi-layer package. The control chip may be bonded to the multi-layer package. The circuit components may be coupled to the arrays of MEMS switches via electrical traces embedded in and/or deposited on the multi-layer package. The control chip may be flip-chip bonded to the multi-layer package. The MEMS switches may be actuated electrostatically or magnetically. The circuit components may include integrated circuits, inductors, capacitors, surface mount devices, and/or transformers.

Claims

1. A method for wireless communication, the method comprising:

controlling one or more arrays of MEMS electrical switches utilizing a control chip, wherein said one or more arrays of MEMS electrical switches and one or more circuit components are integrated in and/or on an integrated circuit multi-layer package, said control chip is bonded to said integrated circuit multi-layer package, and said circuit components comprise transformers.

2. The method according to claim 1, comprising coupling said circuit components to said arrays of MEMS electrical switches via electrical traces embedded in and/or deposited on said multi-layer package.

3. The method according to claim 1, wherein said control chip is flip-chip bonded to said multi-layer package.

4. The method according to claim 1, comprising actuating said MEMS electrical switches electrostatically.

5. The method according to claim 1, comprising actuating said MEMS electrical switches magnetically.

6. The method according to claim 1, wherein said circuit components comprise integrated circuits.

7. The method according to claim 1, wherein said circuit components comprise inductors.

8. The method according to claim 1, wherein said circuit components comprise capacitors.

9. The method according to claim 1, wherein said circuit components comprise surface mount devices.

10. A system for wireless communication, the system comprising:

one or more arrays of MEMS electrical switches controlled utilizing a control chip, wherein said one or more arrays of MEMS electrical switches and one or more circuit components are integrated in and/or on an integrated circuit multi-layer package, said control chip is bonded to said integrated circuit multi-layer package, and said circuit components comprise transformers.

11. The system according to claim 10, wherein said circuit components are coupled to said arrays of MEMS electrical switches via electrical traces embedded in and/or deposited on said multi-layer package.

12. The system according to claim 10, wherein said control chip is flip-chip bonded to said multi-layer package.

13. The system according to claim 10, wherein said MEMS electrical switches are actuated electrostatically.

14. The system according to claim 10, wherein said MEMS electrical switches are actuated magnetically.

15. The system according to claim 10, wherein said circuit components comprise integrated circuits.

16. The system according to claim 10, wherein said circuit components comprise inductors.

17. The system according to claim 10, wherein said circuit components comprise capacitors.

18. The system according to claim 10, wherein said circuit components comprise surface mount devices.

19. A method for wireless communication, the method comprising:

controlling one or more arrays of MEMS electrical switches utilizing a control chip, wherein said one or more arrays of MEMS electrical switches and one or more circuit components are integrated in and/or on a multi-layer package, and said control chip is bonded to said multi-layer package; and

actuating said MEMS electrical switches magnetically.

20. The method according to claim 19, comprising coupling said circuit components to said arrays of MEMS electrical switches via electrical traces embedded in and/or deposited on said multi-layer package.

21. The method according to claim 19, wherein said control chip is flip-chip bonded to said multi-layer package.

22. The method according to claim 19, wherein said circuit components comprise inductors.

23. The method according to claim 19, wherein said circuit components comprise capacitors.

24. The method according to claim 19, wherein said circuit components comprise surface mount devices.

25. A system for wireless communication, the system comprising:

one or more arrays of MEMS electrical switches controlled utilizing a control chip, wherein said one or more arrays of MEMS electrical switches and one or more circuit components are integrated in and/or on a multi-layer package;

said control chip is bonded to said multi-layer package; and

said MEMS electrical switches are actuated magnetically.

26. The system according to claim 25, wherein said circuit components are coupled to said arrays of MEMS electrical switches via electrical traces embedded in and/or deposited on said multi-layer package.

27. The system according to claim 25, wherein said control chip is flip-chip bonded to said multi-layer package.

28. The system according to claim 25, wherein said circuit components comprise integrated circuits.

29. The system according to claim 25, wherein said circuit components comprise inductors.

30. The system according to claim 25, wherein said circuit components comprise capacitors.

31. The system according to claim 25, wherein said circuit components comprise surface mount devices.