Low frequency process-variation-insensitive temperature-stable micromechanical resonators

• US 7,859,365 B2
• Filed: 12/13/2007
• Issued: 12/28/2010
• Est. Priority Date: 12/13/2006
• Status: Expired due to Fees

• Current Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Original Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Inventors: Ayazi, Farrokh, Ho, Gavin Kar-Fai
• Primary Examiner(s): Summons; Barbara
• Application Number:
  US12/001,946
• Publication Number:
  US 20080186109A1
• Time in Patent Office: 1,111 Days
• Field of Search: 333/186, 333/188, 333/200, 310/309, 331/154, 331/156
• US Class Current: 333/186
• CPC Class Codes: H03H 2009/02496 Horizontal, i.e. parallel to the substrate plane
• CPC Class Codes: H03H 3/0076 for obtaining desired frequency or temperature coefficients
• CPC Class Codes: H03H 3/0077 by tuning of resonance frequency
• CPC Class Codes: H03H 9/02448 of temperature influence
• CPC Class Codes: H03H 9/2463 Clamped-clamped beam resonators

Abstract

Disclosed are micromechanical resonators having features that compensate for process variations and provide improved inherent temperature stability. Exemplary resonators may comprise comb drive resonators or parallel-plate drive resonators. The resonators comprise a (silicon-on-insulator) substrate with resonator apparatus formed therein. The resonator apparatus has one or more anchors connected to the substrate, at least one excitation/sense port that is electrically insulated from the substrate, and a resonator. The resonator comprises one or more flexural members connected to the one or more anchors that are separated from the substrate and separated from the excitation/sense port by gaps. A mass is coupled to flexural members, is separated from the substrate, and comprises a grid. Process compensation is achieved using a resonator mass in the form of a grid of lines that form holes or lines through the mass, wherein widths of lines of the grid are approximately ⅓ the width of the flexural members. Temperature stability is provided using silicon dioxide on at least one of the surfaces of the flexural members.

Claims

1. A micromechanical resonator apparatus, comprising:

a substrate; and

a resonator apparatus comprising;

first and second anchors connected to the substrate;

at least one excitation/sense port that is electrically insulated from the substrate, the at least one excitation/sense port comprising a parallel plate capacitive transducer; and

a resonator comprising;

at least one flexural beam member connected to the first and second anchors, the at least one flexural beam member separated from the substrate and separated from the at least one excitation/sense port by one or more gaps, where the at least one flexural beam member is a moveable electrode for the parallel plate capacitive transducer; and

a mass disposed between the first and second anchors, the mass coupled to the at least one flexural beam member between the first and second anchors and separated from the substrate, the mass comprising a grid.

2. The apparatus recited in claim 1 wherein the at least one flexural beam member has a beam width and widths of lines comprising the grid are approximately ⅓

the beam width.

3. The apparatus recited in claim 1 wherein the substrate comprises a semiconductor-on-insulator substrate.

4. The apparatus recited in claim 1 wherein a temperature-compensating material is disposed on at least one of the surfaces of the at least one flexural beam member to alter the temperature coefficient or frequency of the micromechanical resonator.

5. The apparatus recited in claim 1 wherein a tuning voltage applied to the resonator is generated by a bias generator.

6. The apparatus recited in claim 1 wherein the resonator further comprises a second flexural beam member connected to the first and second anchors, the second flexural beam member separated from the substrate, the mass coupled to the at least one flexural beam member at a first end and coupled to the second flexural beam member between the first and second anchors at a second end opposite the first end.

7. A micromechanical resonator apparatus, comprising:

a semiconductor-on-insulator substrate; and

a resonator apparatus comprising;

first and second anchors connected to the semiconductor-on-insulator substrate;

at least one excitation/sense port that is electrically insulated from the semiconductor-on-insulator substrate;

a resonator comprising at least one flexural beam member connected to the first and second anchors, the at least one flexural beam member having a beam width, the at least one flexural beam member separated from the semiconductor-on-insulator substrate and separated from the at least one excitation/sense port by one or more gaps; and

a mass disposed between the first and second anchors, the mass coupled to the at least one flexural beam member and separated from the semiconductor-on-insulator substrate, the mass comprising a grid of lines, the lines approximately ⅓

the beam width.

8. The apparatus recited in claim 7 wherein the at least one excitation/sense port comprises a comb drive having a plurality of interdigitated fingers separated by gaps.

9. The apparatus recited in claim 7 wherein the at least one excitation/sense port comprises a parallel plate drive where the at least one flexural beam member is a moveable electrode for the parallel plate drive.

10. The apparatus recited in claim 7 wherein oxide is disposed on at least one of the surfaces of the at least one flexural beam member.

11. The apparatus recited in claim 7 wherein a tuning voltage applied to the resonator is generated by a bias generator.

12. The apparatus recited in claim 7 wherein the resonator further comprises a second flexural beam member connected to the first and second anchors, the second flexural beam member separated from the semiconductor-on-insulator substrate, the mass coupled to the at least one flexural beam member at a first end and coupled to the second flexural beam member at a second end opposite the first end.

13. A micromechanical resonator apparatus, comprising:

a substrate; and

a resonator apparatus comprising;

one or more anchors connected to the substrate;

at least one excitation/sense port that is electrically insulated from the substrate;

at least one tuning port that is electrically insulated from the substrate; and

a resonator comprising;

at least one flexural beam member connected to the one or more anchors, the at least one flexural beam member having a beam width, the at least one flexural beam member separated from the substrate and separated from the at least one excitation/sense port by one or more gaps and separated from the at least one tuning port by one or more gaps; and

a mass coupled to the at least one flexural beam member and separated from the substrate, the mass comprising a grid;

wherein the at least one excitation/sense port comprises a parallel plate drive where the at least one flexural beam member is a moveable electrode for the parallel plate drive.

14. The apparatus recited in claim 13 wherein the substrate comprises a semiconductor-on-insulator substrate.

15. The apparatus recited in claim 13 wherein oxide is disposed on at least one of the surfaces of the at least one flexural beam member.

16. The apparatus recited in claim 13 wherein a tuning voltage is generated by a bias generator.

17. The apparatus recited in claim 13 wherein widths of lines comprising the grid of the mass are approximately ⅓

the beam width.