Thermal interconnects for coupling energy storage devices

• US 7,859,826 B2
• Filed: 03/06/2008
• Issued: 12/28/2010
• Est. Priority Date: 03/14/2005
• Status: Active Grant

• Current Assignee: UCAP Power, Inc.
• Original Assignee: Maxwell Technologies Incorporated (Tesla Inc.)
• Inventors: Lauper, Philippe, Borkenhagen, James L., Wardas, Mark, Thrap, Guy C., Schneuwly, Adrian
• Primary Examiner(s): Ha; Nguyen T
• Application Number:
  US12/043,592
• Publication Number:
  US 20080266752A1
• Time in Patent Office: 1,027 Days
• Field of Search: 361/502, 361503-504, 361508-512, 361516-519, 361523-529, 361303-305
• US Class Current: 361/502
• CPC Class Codes: H01G 11/74 Terminals, e.g. extensions of current collectors
• CPC Class Codes: H01G 11/76 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 2/02 Mountings
• CPC Class Codes: H01G 9/26 Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• CPC Class Codes: H01M 50/505 comprising a single busbar
• CPC Class Codes: H01M 50/522 Inorganic material
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors

Abstract

A thermally fitted interconnect couples energy storage cells without the use of additional materials of fasteners. Variations of the interconnect can be used to facilitate fitting of multiple energy storage cell with multiple cell to cell spacings in a rapid and inexpensive manner.

Claims

1. An apparatus for connecting to a terminal of a capacitor, comprising:

an interconnect, the interconnect including one or more void formed therein, wherein the one or more void is definable by a shape that is smaller than a corresponding shape of a capacitor terminal the void is intended to be coupled to.

2. The apparatus of claim 1, wherein the interconnect is dimensioned to pass at least 1000 amperes of current.

3. The apparatus of claim 1, wherein interconnect couples two capacitors together in a series connection.

4. The apparatus of claim 1, wherein the interconnect couples two capacitors together in an axially oriented string.

5. The apparatus of claim 1, wherein the interconnect has disposed thereon a thermal pad.

6. The apparatus of claim 1, wherein the interconnect is disposed within a substrate.

7. The apparatus of claim 1, wherein the interconnect comprises a staking hole for receiving a conductor.