Lead retention assembly for implantable medical device

• US 7,860,568 B2
• Filed: 04/23/2008
• Issued: 12/28/2010
• Est. Priority Date: 04/23/2008
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Peters, Charles Edward, Deininger, Steve T., Clayton, Jeffrey J.
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): Gedeon; Brian T
• Application Number:
  US12/107,828
• Publication Number:
  US 20090270940A1
• Time in Patent Office: 979 Days
• Field of Search: 607/36, 607/37, 439/190, 439/288, 439/309
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A lead retention assembly for an implantable medical device includes (i) a conductive set screw and (ii) a housing defining an opening for receiving at least a portion of the set screw. The assembly further includes a block disposed within the housing. The block defines a lead receiving bore and a second bore extending generally perpendicular to and intersecting with the lead receiving bore. The assembly further includes a conductive lead engagement member having a lead engagement feature. The lead engagement feature is disposed within and movable within the second bore such that advancement of the set screw causes the lead engagement feature to move within the second bore towards the lead receiving bore. The set screw is electrically isolated from the conductive lead engagement member.

Claims

1. A lead retention assembly for an implantable medical device, comprising:

a conductive set screw;

a housing defining an opening for receiving at least a portion of the set screw;

a block disposed within the housing and defining a lead receiving bore and a second bore extending generally perpendicular to and intersecting with the lead receiving bore; and

a conductive lead engagement member having a lead engagement feature, wherein the lead engagement feature is disposed within and movable within the second bore such that advancement of the set screw causes the lead engagement feature to move within the second bore towards the lead receiving bore,

wherein the set screw is electrically isolated from the conductive lead engagement member.

2. The assembly of claim 1, further comprising a nonconductive member configured to at least in part electrically isolate the set screw from the conductive lead engagement member, wherein the nonconductive member is disposed within the housing such that advancement of the set screw causes the nonconductive member to cause the lead engagement feature to move within the second bore towards the lead receiving bore.

3. The assembly of claim 2, wherein the nonconductive member comprises a set screw retention feature.

4. The assembly of claim 2, wherein the lead engagement member, the nonconductive member and the set screw are disposed in axial alignment.

5. The assembly of claim 2, further comprising a sealing member disposed within the housing,

wherein the nonconductive member has (i) an exterior surface and (ii) interior surface defining a cavity configured to receive at least a portion of the set screw, and

wherein the sealing member sealingly engages the exterior surface of the nonconductive member.

6. The assembly of claim 1, wherein the opening defined by the housing is internally threaded and configured to engage a threaded portion of the set screw.

7. The assembly of claim 6, wherein the housing is formed from conductive material.

8. The assembly of claim 1, wherein the assembly is configured such that the set screw is exposed to bodily fluid when the header is implanted in a patient.

9. An implantable medical device comprising:

an assembly according to claim 1;

a hermetically sealed device housing attached to the housing of the assembly;

electronics disposed within the device housing,

wherein the electronics are electrically coupled to the conductive lead engagement member.

10. The device of claim 9, wherein the assembly housing and the device housing together form a hermetically sealed internal chamber.

11. A method for manufacturing a lead retention assembly for an implantable medical device, the method comprising:

axially aligning a second bore of a block with an opening in a housing of the assembly, the block defining the second bore and a lead receiving first bore, the second bore extending generally perpendicular to and intersecting with the lead receiving bore, wherein the opening of the housing is configured to threadingly engage a set screw;

placing a lead engagement feature of a conductive lead engagement member within the second bore of the conductive block;

inserting a molding pin through the opening pin and pressing the engagement feature towards the conductive block;

flowing a sealing material into the housing and around the molding pin;

removing the molding pin to create a cavity formed by the sealing material, wherein the cavity is in communication with the opening and is axially aligned with the opening and the lead engagement member; and

placing a nonconductive member in the cavity between the opening of the housing and the lead engagement member, wherein the nonconductive member comprises an exterior surface and interior surface defining a set screw receiving cavity, wherein the nonconductive member is placed in the cavity formed by the sealing material such that exterior surface of the nonconductive member sealingly engages the sealing material.

12. The method of claim 11, further comprising threading the set screw through the opening of the housing such that a portion of the set screw is received in the cavity formed by the interior surface of the nonconductive member.

13. A method for manufacturing a medical device, comprising:

manufacturing the assembly according to the method of claim 11; and

operably coupling the conductive lead engagement member of the assembly to electronics of the device.

14. A lead retention assembly for an implantable medical device, comprising:

a conductive set screw;

a housing defining an opening for receiving at least a portion of the set screw;

a conductive block disposed within the housing and defining a lead receiving bore and a second bore extending generally perpendicular to and intersecting with the lead receiving bore; and

a lead engagement member having a lead engagement feature, wherein the lead engagement feature is disposed within and movable within the second bore such that advancement of the set screw causes the lead engagement feature to move within the second bore towards the lead receiving bore,

wherein the set screw is electrically isolated from the conductive block.

15. The assembly of claim 14, wherein the lead engagement member is non-conductive, wherein the lead engagement member at least in part electrically isolates the set screw from the conductive block.

16. The assembly of claim 14, further comprising a nonconductive member configured to at least in part electrically isolate the set screw from the conductive block, wherein the nonconductive member is disposed within the housing such that advancement of the set screw causes the nonconductive member to cause the lead engagement feature to move within the second bore towards the lead receiving bore.

17. The assembly of claim 16, further comprising a sealing member disposed within the housing,

wherein the nonconductive member has (i) an exterior surface and (ii) interior surface defining a cavity configured to receive at least a portion of the set screw, and

wherein the sealing member sealingly engages the exterior surface of the nonconductive member.

18. The assembly of claim 14, wherein the opening defined by the housing is internally threaded and configured to engage a threaded portion of the set screw.

19. The assembly of claim 18, wherein the housing is formed from conductive material.

20. The assembly of claim 14, wherein the assembly is configured such that the set screw is exposed to bodily fluid when the header is implanted in a patient.