System and method for self-contained structural health monitoring for composite structures

• US 7,860,664 B2
• Filed: 02/13/2009
• Issued: 12/28/2010
• Est. Priority Date: 04/15/2008
• Status: Active Grant

• Current Assignee: Spirit Aerosystems Incorporated (Spirit Aerosystems Holdings Incorporated)
• Original Assignee: Spirit Aerosystems Incorporated (Spirit Aerosystems Holdings Incorporated)
• Inventors: Tadayon, Farhad J., Loomis, Kevin S.
• Primary Examiner(s): Dunn; Drew A
• Assistant Examiner(s): Cherry; Stephen J
• Application Number:
  US12/371,046
• Publication Number:
  US 20090259411A1
• Time in Patent Office: 683 Days
• Field of Search: 702/34, 702/35, 702/36, 702/183, 702/184, 702/185
• US Class Current: 702/35
• CPC Class Codes: G01B 7/16 for measuring the deformation in a solid, e.g. by resistance strain gauge
• CPC Class Codes: G01M 5/00 Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings G01M9/00 takes precedence

Abstract

A system and method for structural health monitoring (SHM) of a physical structure, such as an aircraft component. The system may comprise a central data acquisition module and a plurality of wireless, self-contained sensor wafers bonded to a surface of the physical structure. The central data acquisition module and the sensor wafers may be communicably coupled in a hierarchical order. If any of the sensor wafers detects a structural fault, it may be stored in a memory of the central data acquisition module for retrieval by maintenance personnel. If one or more of the sensor wafers malfunctions, the central data acquisition module may reconfigure the hierarchical order in which the sensor wafers communicate to exclude the malfunctioning sensor wafer or wafers. The sensor wafers may include a sensor, circuitry, a wireless antenna, and a power source.

Claims

1. A structural health monitoring (SHM) system for monitoring the structural health of a physical structure having at least one surface, the SHM system comprising:

a central data acquisition module for sending and receiving wireless signals containing data associated with the structural health of a physical structure, the central data acquisition module comprising a processor and memory;

a plurality of sensor wafers configured to be bonded to the surface of the physical structure and communicably coupled with each other and the central data acquisition module in a hierarchical manner, each sensor wafer comprising;

a sensor for converting at least one of mechanical or thermal energy into an electrical signal, and

circuitry for receiving and routing data signals between the sensor and other designated ones of the sensor wafers or the central data acquisition module,

wherein at least one of the wireless antenna and a plurality of circuitry traces is direct write (DW) deposited onto a carbon fiber ply.

2. The SHM system of claim 1, wherein the memory of the central data acquisition module stores mapping data regarding the hierarchical order in which the sensor wafers communicate with each other and with the central data acquisition module, such that each sensor communicates with designated ones of the sensor wafers.

3. The SHM system of claim 1, wherein the processor analyzes the signals received by the sensor wafers and reconfigures the mapping data within the memory if at least one of the sensor wafers is malfunctioning.

4. The SHM system of claim 3, wherein the processor reconfigures the mapping data to exclude any malfunctioning sensor wafer from the hierarchical order and to command at least some of the other sensor wafers to monitor a portion of the at least one surface previously monitored by the malfunctioning sensor wafer.

5. The SHM system of claim 1, wherein each of the sensor wafers further comprise:

a wireless antenna, and

a power source for providing power for operating the circuitry.

6. The SHM system of claim 1, wherein the physical structure is a composite part and the sensor wafers are bonded to the composite part during or after curing of the composite part.

7. The SHM system of claim 1, wherein the sensor wafers are covered with an epoxy-based protective coating.

8. The SHM system of claim 1, wherein the data signals may comprise information regarding at least one of a type of signal detected, a significant change in the signal detected, what sensor wafer the signal originated from, and a time at which a structural fault was detected.

9. A structural health monitoring (SHM) system for monitoring the structural health of a physical structure having at least one surface, the SHM system comprising:

a central data acquisition module for sending and receiving wireless signals containing data associated with the structural health of a physical structure, the central data acquisition module comprising a processor and memory;

a plurality of self-contained sensor wafers configured to be bonded to the surface of the physical structure and wirelessly communicably coupled hierarchically with each other and the central data acquisition module, each sensor wafer comprising;

a sensor for converting at least one of mechanical and thermal energy into an electrical signal,

circuitry for receiving and routing data signals between the sensor and the other sensor wafers or the central data acquisition module, and

a wireless antenna direct write (DW) deposited onto at least one of a carbon fiber ply and a fiberglass ply,

wherein the memory of the central data acquisition module stores mapping data regarding the hierarchical order in which the sensor wafers communicate with each other and with the central data acquisition module.

10. The SHM system of claim 9, wherein the processor analyzes the signals received by the sensor wafers and reconfigures the mapping data within the memory if at least one of the sensor wafers is malfunctioning.

11. The SHM system of claim 10, wherein the processor reconfigures the mapping data to exclude any malfunctioning sensor wafer from the hierarchical order and to command at least some of the other sensor wafers to monitor a portion of the at least one surface previously monitored by the malfunctioning sensor wafer.

12. The SHM system of claim 9, wherein the physical structure is a composite part and the sensor wafers are bonded to the composite part during or after curing of the composite part.

13. The SHM system of claim 9, wherein the sensor wafers are covered with an epoxy-based protective coating.

14. The SHM system of claim 9, further comprising a power source for providing power for operating the circuitry.

15. The SHM system of claim 14, wherein the power source is a power harvesting source that converts vibrations into electrical energy.

16. The SHM system of claim 9, wherein the SHM system is configured to reconfigure the mapping data within the memory if additional sensor wafers are added to the SHM system.