Configuration of multiple LED modules

• US 7,862,211 B2
• Filed: 10/20/2008
• Issued: 01/04/2011
• Est. Priority Date: 10/16/2000
• Status: Expired due to Term

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Späth, Werner, Marchl, Werner, Waitl, Günter
• Primary Examiner(s): Lee; Y My Quach
• Application Number:
  US12/288,376
• Publication Number:
  US 20090052178A1
• Time in Patent Office: 806 Days
• Field of Search: 362/294, 362/547, 362/373, 362/800
• US Class Current: 362/294
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Claims

1. A configuration of multiple modules, comprising:

a plurality of LED modules each containing;

a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area of said carrier having a planar configuration; and

a plurality of separate LED semiconductor bodies applied on said first main area of said carrier of said each of said plurality of LED modules; and

a common heat sink,

wherein said second main area of said carrier is connected to said common heat sink.

2. The configuration of multiple modules according to claim 1, wherein said common heat sink is formed of a material selected from the group consisting of copper and aluminum.

3. The configuration of multiple modules according to claim 1, wherein said semiconductor layer of each of said plural LED modules adjoins said common heat sink.

4. The configuration of multiple modules according to claim 3, wherein said semiconductor layer of each of said LED modules is connected to said common heat sink by one of a soldering compound and a thermally conductive adhesive.

5. The configuration of multiple modules according to claim 1, further comprising conductor tracks disposed between said plural LED modules.

6. The configuration of multiple modules according to claim 5, further comprising a conductor track carrier bearing on said common heat sink, wherein said conductor tracks are formed on said conductor track carrier.

7. The configuration of multiple modules according to claim 6, wherein said conductor track carrier is selected from the group consisting of printed circuit boards, flexible printed circuit boards, printed circuit board sheets and flex-boards.

8. The configuration of multiple modules according to claim 1, wherein the LED semiconductor bodies are configured to be driven and switched independently of one another.

9. The configuration of multiple modules according to claim 1, wherein each of said semiconductor layers is electrically isolated from each of the LED semiconductor bodies.

10. The configuration of multiple modules according to claim 1, further comprising a reflector having a lattice-like form in plan view.

11. The configuration of multiple modules according to claim 6, further comprising a reflector, wherein the reflector is borne by a side of the conductor track carrier remote from the common heat sink.

12. The configuration of multiple modules according to claim 1, wherein the LED semiconductor bodies are prefabricated and unhoused.

13. The configuration of multiple modules according to claim 1, wherein the LED semiconductor bodies are electrically connected via a side facing the carrier and via a side remote from the carrier.

14. The configuration of multiple modules according to claim 1, wherein the at least one semiconductor layer of each of said plurality of LED modules is made of silicon.

15. The configuration of multiple modules according to claim 1, wherein said carriers of said plurality of LED modules are separated from one another.

16. A configuration of multiple modules, comprising:

a plurality of LED modules each comprising;

a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; and

a plurality of separate LED semiconductor bodies applied onto said first main areas of said carriers;

a common heat sink, said carriers of said LED modules being connected to said common heat sink on said second main areas; and

conductor tracks disposed between said plurality of LED modules,

wherein said conductor tracks are electrically connected with the LED modules via wire connections.

17. The configuration of multiple modules according to claim 16, wherein the LED semiconductor bodies are configured to be driven and switched independently of one another.

18. The configuration of multiple modules according to claim 16, wherein said plurality of LED modules each comprise a plurality of mutually isolated metal areas applied on the respective carrier, each of the metal areas comprising a chip connection region, and wherein a number of said metal areas is equal to a number of connection regions for external wire connection.

19. The configuration of multiple modules according to claim 18, wherein each of said connection regions is a partial region of one of said metal areas.

20. The configuration of multiple modules according to claim 16, wherein the carrier of each of the plurality of LED modules has a surface facing the common heat sink and being completely connected to the common heat sink by means of a solder or by means of a thermally conductive adhesive.

21. The configuration of multiple modules according to claim 16, wherein at least one of the plurality of separate LED semiconductor bodies is applied on each of said first main areas of said carriers.

22. The configuration of multiple modules according to claim 16, wherein at least two of the plurality of separate LED semiconductor bodies are applied on each of said first main areas of said carriers.

23. The configuration of multiple modules according to claim 16, wherein said carriers of said plurality of LED modules are separated from one another.

24. A configuration of multiple modules, comprising:

a plurality of LED modules each comprising;

a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration;

a plurality of separate LED semiconductor bodies applied on said first main areas of said carriers; and

an insulating layer arranged between the plurality of separate LED semiconductor bodies and the at least one semiconductor layer; and

a common heat sink;

wherein said carriers of said plurality of LED modules are connected to said common heat sink on said second main areas.

25. The configuration of multiple modules according to claim 24, wherein the at least one semiconductor layer of each of said plurality of LED modules is made of silicon.

26. The configuration of multiple modules according to claim 24, wherein the plurality of LED semiconductor bodies are unhoused.

27. The configuration of multiple modules according to claim 24, wherein said carriers of said plurality of LED modules are separated from one another.