Microfeature workpieces and methods for forming interconnects in microfeature workpieces

• US 7,863,187 B2
• Filed: 09/01/2005
• Issued: 01/04/2011
• Est. Priority Date: 09/01/2005
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Dando, Ross S., Hiatt, William M.
• Primary Examiner(s): Zarneke; David A
• Application Number:
  US11/217,169
• Publication Number:
  US 20070049016A1
• Time in Patent Office: 1,951 Days
• Field of Search: 438/667
• US Class Current: 438/667
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811

Abstract

Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. The microfeature workpieces may have a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side. In one embodiment, a method includes (a) constructing an electrically conductive interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal, and (b) removing material from the second side of the substrate so that a portion of the interconnect projects from the substrate.

Claims

1. A method for forming an interconnect in a microfeature workpiece, the microfeature workpiece including a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side, the method comprising:

constructing an electrically conductive interconnect with a barrier material insulating the interconnect from the substrate and covering an end of the interconnect, the interconnect extending from the terminal to at least an intermediate depth in the substrate with the interconnect electrically connected to the terminal;

removing material from the second side of the substrate and from the barrier material so that a portion of the interconnect projects from the substrate and the interconnect has an exposed, conductive surface at the end of the interconnect;

depositing a first dielectric layer composed of a first material onto the exposed, conductive surface of the portion of the interconnect that projects from the substrate and thereby covering the portion of the interconnect that projects from the substrate; and

depositing a second dielectric layer composed of a second material onto the first dielectric layer such that the second dielectric layer covers the first dielectric layer, wherein the first material is different than the second material, and wherein the first material is removable by a removal process that generally does not affect the second dielectric layer.

2. The method of claim 1 wherein:

constructing the electrically conductive interconnect comprises forming an interconnect having a conductive fill material in a hole in the substrate and a conductive layer in the hole between the conductive fill material and the substrate, with the conductive fill material and the conductive layer extending from the terminal to the at least intermediate depth in the substrate;

removing material from the second side of the substrate comprises (a) thinning the substrate from the second side so that a section of the interconnect is exposed, and (b) selectively etching the substrate so that the portion of the interconnect projects from the substrate; and

the method further comprises (a) removing a section of the conductive fill material from the portion of the interconnect so that the conductive fill material is recessed relative to the conductive layer, (b) applying a dielectric layer to the second side of the substrate and the portion of the interconnect after removing the section of the conductive fill material, (c) removing at least a section of the dielectric layer covering the portion of the interconnect to expose a section of the interconnect, and (d) forming a conductive member on the section of the interconnect.

3. The method of claim 1 wherein removing material from the second side of the substrate comprises:

thinning the substrate from the second side so that a section of the interconnect is exposed; and

selectively etching the substrate so that the portion of the interconnect projects from the substrate.

4. The method of claim 1 wherein:

constructing the electrically conductive interconnect comprises forming an interconnect having a conductive fill material in a hole in the substrate and a conductive layer in the hole between the conductive fill material and the substrate, with the conductive fill material and the conductive layer extending from the terminal to the at least intermediate depth in the substrate; and

the method further comprises removing a section of the conductive fill material from the portion of the interconnect so that the conductive fill material is recessed relative to the conductive layer.

5. The method of claim 1 wherein the first material comprises parylene HT and the second material comprises silicon oxide (SiO₂).

6. The method of claim 1 wherein depositing at least one of the first and second dielectric layers comprises depositing by chemical vapor deposition.

7. The method of claim 1, further comprising forming a conductive member on the portion of the conductive interconnect.

8. The method of claim 1, further comprising plating a conductive cap onto the portion of the conductive interconnect.

9. The method of claim 3 wherein selectively etching comprises etching the substrate so that the portion of the interconnect projects between approximately 5 and 10 microns from the substrate.

10. The method of claim 3 wherein thinning the substrate comprises at least one of grinding, chemical-mechanical polishing, mechanical polishing, or chemical polishing the substrate.

11. The method of claim 1 wherein removing material from the second side of the substrate occurs after constructing the electrically conductive interconnect.

25. The method of claim 1 wherein depositing the first dielectric layer comprises depositing through a first process, and depositing the second dielectric layer comprises depositing through a second process different from the first process.

36. The method of claim 1, further comprising exposing a portion of the first dielectric layer through the second dielectric layer over the portion of the interconnect.

37. The method of claim 1, further comprising removing the exposed portion of the first dielectric layer through the selective removal process.

12. A method for forming an interconnect in a microfeature workpiece, the method comprising:

providing a microfeature workpiece having (a) a substrate with a first side and a second side opposite the first side, (b) a terminal carried by the first side of the substrate, and (c) an electrically conductive interconnect extending from the terminal through the substrate and projecting from the second side of the substrate;

applying a first dielectric layer composed of a first material to the second side of the substrate and to an uncoated, conductive surface of the portion of the interconnect projecting from the second side of the substrate;

applying a second dielectric layer composed of a second material to the first dielectric layer such that the second dielectric layer covers, wherein the first material and the second material are different materials, and wherein the first material is removable by a first process and the second material is removable by a second process;

removing a section of the first and second dielectric layers to expose a surface of the interconnect with the interconnect intersecting a plane defined by the remaining section of the dielectric layers.

13. The method of claim 12 wherein providing the microfeature workpiece comprises:

constructing the electrically conductive interconnect in the substrate with the interconnect extending from the terminal to at least an intermediate depth in the substrate; and

removing material from the second side of the substrate so that the portion of the interconnect projects from the substrate.

14. The method of claim 12 wherein at least one of applying the first dielectric layer and applying the second dielectric layer comprises depositing parylene.

15. The method of claim 12 wherein at least one of the first and second processes polishing the workpiece.

16. The method of claim 12, further comprising forming a conductive member on the exposed surface of the interconnect.

17. The method of claim 12 wherein at least one of the first and second processes comprises removing the section of the respective dielectric layer without photolithography.

18. The method of claim 12 wherein removing the section of the first and second dielectric layers comprises:

removing a portion of the section of the second dielectric layer in a first process; and

removing a portion of the remaining dielectric layer in a second process different than the first process.

26. The method of claim 12 wherein applying the first dielectric layer comprises applying through a first process, and

applying the second dielectric layer to the first dielectric layer comprises applying through a second process, wherein the first process is different from the second process.

19. A method for forming an interconnect in a microfeature workpiece, the microfeature workpiece including a terminal and a substrate with a first side carrying the terminal and a second side opposite the first side, the method comprising:

forming an electrically conductive interconnect having a first portion at the terminal and a second portion at an intermediate depth in the substrate, the electrically conductive interconnect being electrically connected to the terminal;

thinning the substrate from the second side to at least the second portion of the interconnect;

applying a first dielectric layer composed of a first material to the second side of the substrate and thereby covering the second portion of the interconnect after thinning the substrate;

applying a second dielectric layer composed of a second material to at least a portion of the first dielectric layer such that the second dielectric layer covers at least a portion of the first dielectric layer that covers the second portion of the interconnect, wherein the first and second materials are different materials, and wherein the first material is susceptible to etching and the second material is resistant to etching.

20. The method of claim 19 wherein thinning the substrate comprises removing material from the second side of the substrate so that the second portion of the interconnect projects from the substrate.

21. The method of claim 19, further comprising selectively etching the substrate so that the second portion of the interconnect projects from the substrate.

22. The method of claim 19 wherein:

forming the electrically conductive interconnect comprises constructing an interconnect having a conductive fill material in a hole in the substrate and a conductive layer in the hole between the conductive fill material and the substrate, with the conductive fill material and the conductive layer extending from the terminal to the at least intermediate depth in the substrate; and

the method further comprises removing a section of the conductive fill material from the portion of the interconnect so that the conductive fill material is recessed relative to the conductive layer.

23. The method of claim 19, further comprising forming a conductive member on the exposed surface of the conductive interconnect.

24. The method of claim 19 wherein removing a portion of the second dielectric layer comprises at least one of grinding, chemical-mechanical polishing, mechanical polishing, or chemical polishing.

27. The method of claim 19 wherein applying the dielectric layer to the second side of the substrate comprises applying through a first process, and

applying the second dielectric layer to at least a portion of the first dielectric layer comprises applying through a second process, wherein the first process is different from the second process, and at least one of the first and second processes comprises chemical vapor deposition.

38. The method of claim 19, further comprising removing a portion of the second dielectric layer covering the portion of the first dielectric layer.

39. The method of claim 19, further comprising exposing a surface of the second portion of the interconnect using an etching process that does not substantially affect the second dielectric layer.

28. A method for constructing an interconnect in a microfeature workpiece with an initial dielectric layer attached to a first side of a substrate, the method comprising:

forming an interconnect extending through the initial dielectric layer and extending to at least an intermediate depth in the substrate;

thinning the substrate by removing material from a second side of the substrate and from the interconnect;

removing additional material from the second side of the substrate using a selective etchant such that a portion of the interconnect protrudes from the second side of the substrate;

forming a recess in the portion of the interconnect by removing a portion of material from the portion of the interconnect;

forming a dielectric structure over the portion of the interconnect, the dielectric structure comprising a first dielectric layer and a second dielectric layer on the first dielectric layer, wherein the first and second dielectric layers are composed of different materials;

removing sections of the dielectric structure and the portion of the interconnect such that the second dielectric layer is removed to expose the first dielectric layer; and

removing the first dielectric layer from the portion of the interconnect to form a recess in the portion of the interconnect to expose conductive fill material in the interconnect.

29. The method of claim 28 wherein forming the interconnect comprises insulating the interconnect from the substrate with dielectric material.

30. The method of claim 28 wherein forming the interconnect comprises forming a conductive fill material separated from the substrate by dielectric material, a diffusion barrier, a seed layer, and a conductive layer.

31. The method of claim 28 wherein forming the dielectric structure comprises using at least one of atomic layer deposition, physical vapor deposition, and chemical vapor deposition.

32. The method of claim 28 wherein forming the interconnect comprises forming a conductive fill material using at least one of plating processes, solder wave processes, screen printing processes, reflow processes, and vapor deposition processes.

33. The method of claim 28 wherein removing sections of the dielectric structure comprises using an etchant that is selective to at least one of the first and the second dielectric layers.

34. The method of claim 28 wherein thinning the substrate by removing material comprises removing material by at least one of grinding, dry etching, chemical etching, chemical polishing, and chemical-mechanical polishing.

35. The method of claim 28 wherein removing additional material comprises removing the additional material using a plasma etching process.