Light-emitting diode lamp with low thermal resistance
First Claim
1. A light-emitting diode structure comprising:
- a light-emitting diode semiconductor layer disposed directly adjacent a metal substrate enclosed in a ceramic casing;
a secondary metal plate electrically connected to a bond pad on the semiconductor layer and exposed through a bottom portion of the ceramic casing;
a primary metal plate having an upper and a lower tier, wherein the upper tier of the primary metal plate is electrically and thermally conductively connected to the metal substrate via a first metal bonding layer and enclosed in the ceramic casing and the lower tier of the primary metal plate is exposed through a bottom portion of the casing; and
a second metal bonding layer disposed below the ceramic casing and the lower tier of the primary metal plate.
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Accused Products
Abstract
A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.
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Citations
23 Claims
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1. A light-emitting diode structure comprising:
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a light-emitting diode semiconductor layer disposed directly adjacent a metal substrate enclosed in a ceramic casing; a secondary metal plate electrically connected to a bond pad on the semiconductor layer and exposed through a bottom portion of the ceramic casing; a primary metal plate having an upper and a lower tier, wherein the upper tier of the primary metal plate is electrically and thermally conductively connected to the metal substrate via a first metal bonding layer and enclosed in the ceramic casing and the lower tier of the primary metal plate is exposed through a bottom portion of the casing; and a second metal bonding layer disposed below the ceramic casing and the lower tier of the primary metal plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A light-emitting diode (LED) structure comprising:
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an LED semiconductor layer disposed directly on a metal substrate, wherein the semiconductor layer and the metal substrate are enclosed in a ceramic casing; a primary metal plate having an upper and a lower tier, wherein the upper tier of the primary metal plate is electrically and thermally coupled to the metal substrate and enclosed in the ceramic casing and the lower tier of the primary metal plate is external to the casing; a secondary metal plate having an upper and a lower tier, wherein the upper tier of the secondary metal plate is electrically coupled to the semiconductor layer and enclosed in the ceramic casing and the lower tier of the secondary metal plate is external to the casing; and a first metal bonding layer disposed below the ceramic casing and the lower tier of the primary metal plate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification