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Light-emitting diode lamp with low thermal resistance

  • US 7,863,639 B2
  • Filed: 04/12/2006
  • Issued: 01/04/2011
  • Est. Priority Date: 04/12/2006
  • Status: Active Grant
First Claim
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1. A light-emitting diode structure comprising:

  • a light-emitting diode semiconductor layer disposed directly adjacent a metal substrate enclosed in a ceramic casing;

    a secondary metal plate electrically connected to a bond pad on the semiconductor layer and exposed through a bottom portion of the ceramic casing;

    a primary metal plate having an upper and a lower tier, wherein the upper tier of the primary metal plate is electrically and thermally conductively connected to the metal substrate via a first metal bonding layer and enclosed in the ceramic casing and the lower tier of the primary metal plate is exposed through a bottom portion of the casing; and

    a second metal bonding layer disposed below the ceramic casing and the lower tier of the primary metal plate.

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