Performance-enhancing two-sided MEMS anchor design for vertically integrated micromachined devices

• US 7,863,698 B2
• Filed: 04/03/2009
• Issued: 01/04/2011
• Est. Priority Date: 04/03/2009
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Seeger, Joseph, Castro, Alexander, Yaralioglu, Goksen G., Borovic, Bruno
• Primary Examiner(s): Tran; Tan N
• Application Number:
  US12/418,554
• Publication Number:
  US 20100252897A1
• Time in Patent Office: 641 Days
• Field of Search: 257/415, 257/254, 257/E29.324
• US Class Current: 257/415
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81C 1/00039 Anchors

Abstract

An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.

Claims

1. An assembly for anchoring a micro-electro-mechanical system (MEMS) device, the MEMS device comprising a top substrate;

and a bottom substrate substantially parallel to the top substrate;

the assembly comprising;

a first portion of the anchoring assembly between the top substrate and the bottom substrate;

the first portion of the anchoring assembly rigidly connected to the top substrate; and

the first portion of the anchoring assembly rigidly connected to the bottom substrate;

a second portion of the anchoring assembly between the top substrate and the bottom substrate;

the second portion of the anchoring assembly rigidly connected to the top substrate;

the second portion of the anchoring assembly being an anchoring point for the MEMS device; and

a flexible element to couple the first portion and the second portion;

the flexible element providing the electrical connection between the first portion and the second portion.

2. A micro-electro-mechanical system (MEMS) device comprising:

a first substrate;

an actuator layer;

a second substrate;

an anchor subassembly in the actuator layer;

wherein the anchor subassembly includes;

a first portion of the anchoring assembly between the top substrate and the bottom substrate;

the first portion of the anchoring assembly rigidly connected to the top substrate;

and the first portion of the anchoring assembly rigidly connected to the bottom substrate;

a second portion of the anchoring assembly between the top substrate and the bottom substrate;

the second portion of the anchoring assembly rigidly connected to the top substrate;

the second portion of the anchoring assembly being an anchoring point for the MEMS device; and

a flexible element to couple the first portion and the second portion;

the flexible element providing the electrical connection between the first portion and the second portion.

3. An assembly for anchoring a micro-electro-mechanical system (MEMS) device, the assembly comprising:

a top substrate;

a bottom substrate substantially parallel to the top substrate;

a first portion of the anchor between the top substrate and the bottom substrate;

the first portion of the anchor rigidly connected to the top substrate; and

the first portion of the anchor rigidly connected to the bottom substrate;

a second portion of the anchor between the top substrate and the bottom substrate;

the second portion of the anchor rigidly connected to the bottom substrate;

the second portion of the anchor being an anchoring point for the MEMS device; and

a substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor;

the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.

4. The assembly of claim 3 wherein:

the flexible element is substantially rigid in the direction perpendicular to the top substrate and to the direction perpendicular to the bottom substrate to provide enough pressure for bonding;

the flexible element is substantially flexible in the direction parallel to the top substrate and to the bottom substrate to decouple two portions of the anchor mechanically.

5. The assembly of claim 3 wherein:

the first portion of the anchor and the second portion of the anchor are eutecticly bonded to an exposed and continuous aluminum plate on the bottom (ASIC) substrate such that bond starts forming under the first portion of the anchor and propagates towards the second portion of the anchor.

8. The MEMS device of claim 4 wherein the first portion of the anchor encircles the second portion of the anchor.

9. The MEMS device of claim 4 wherein the second portion of the anchor encircles the first portion of the anchor.

10. The MEMS device of claim 4 wherein the first portion of the anchor is parallel to the second portion of the anchor.

6. A micro-electro-mechanical system (MEMS) device, comprising:

a first substrate;

an actuator layer;

a second substrate;

an anchor subassembly in actuator layer;

wherein the anchor subassembly includes;

a first portion of the anchor between the top substrate and the bottom substrate;

the first portion of the anchor rigidly connected to the top substrate; and

the first portion of the anchor rigidly connected to the bottom substrate;

a second portion of the anchor between the top substrate and the bottom substrate;

the second portion of the anchor rigidly connected to the bottom substrate;

the second portion of the anchor being an anchoring point for the MEMS device; and

a substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor;

the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.

7. The assembly of claim 6 wherein:

the first portion of the anchor and the second portion of the anchor are eutecticly bonded to an exposed and continuous aluminum plate on the bottom (ASIC) substrate such that bond starts forming under the first portion of the anchor and propagates towards the second portion of the anchor.