Roll-to-roll fabricated encapsulated semiconductor circuit devices
First Claim
1. An encapsulated semiconductor device, comprising:
- a first substrate having an electrically conductive surface;
a second substrate having an electrically conductive pattern disposed thereon;
a pattern of semiconductor elements, each of said semiconductor elements having a first conductor and a second conductor;
an adhesive having said pattern of semiconductor elements fixed thereto and disposed between said electrically conductive surface and said electrically conductive pattern to form a lamination, said adhesive being activatable to bind said second substrate to said first substrate so that one of said first conductor and said second conductor of at least one of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive pattern of said second substrate and so that the other of said first conductor and said second conductor of each of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive surface of said first substrate.
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Accused Products
Abstract
An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.
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Citations
9 Claims
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1. An encapsulated semiconductor device, comprising:
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a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; a pattern of semiconductor elements, each of said semiconductor elements having a first conductor and a second conductor; an adhesive having said pattern of semiconductor elements fixed thereto and disposed between said electrically conductive surface and said electrically conductive pattern to form a lamination, said adhesive being activatable to bind said second substrate to said first substrate so that one of said first conductor and said second conductor of at least one of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive pattern of said second substrate and so that the other of said first conductor and said second conductor of each of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive surface of said first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification