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Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits

  • US 7,863,918 B2
  • Filed: 11/13/2007
  • Issued: 01/04/2011
  • Est. Priority Date: 11/13/2007
  • Status: Active Grant
First Claim
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1. A method for self-testing an integrated circuit layer for a three-dimensional integrated circuit, comprising:

  • integrally forming a disposable self-test circuit on a common substrate with a first circuit to be tested, the first circuit for forming a layer in a three-dimensional integrated circuit structure;

    testing the first circuit using circuitry of the self-test circuit by employing the self-test circuit to simulate conditions of an assembled three-dimensional integrated circuit chip for which the first chip is a component; and

    removing the self-test circuit by detaching the self-test circuit from the first circuit.

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