Molded or encapsulated transmit-receive module or TR module/antenna element for active array
First Claim
1. An arrangement comprisinga solid dielectric mass enclosing a heat-producing active electrical element, the solid dielectric mass defining a heat pipe in thermal communication with said heat-producing active electrical element,wherein said heat pipe consists of an elongated channel in said solid dielectric mass, the inner surface of which elongated channel is said solid dielectric mass, the heat pipe extending through said solid dielectric mass to a location remote from said electrical element,wherein said heat pipe also includes a wick extending along substantially the entire length of said channel and a vaporizable coolant liquid within said channel;
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Accused Products
Abstract
An array of electrically conductive waveguides is made a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered with the planar surfaces of another slab, to form one or more closed waveguides. The waveguides may feed microchips, or act as antennas. The slabs may include electrical conductors andor heat pipes. Heat pipes are made by defining apertures with the dielectric slabs, and introducing wick material into the apertures.
44 Citations
23 Claims
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1. An arrangement comprising
a solid dielectric mass enclosing a heat-producing active electrical element, the solid dielectric mass defining a heat pipe in thermal communication with said heat-producing active electrical element, wherein said heat pipe consists of an elongated channel in said solid dielectric mass, the inner surface of which elongated channel is said solid dielectric mass, the heat pipe extending through said solid dielectric mass to a location remote from said electrical element, wherein said heat pipe also includes a wick extending along substantially the entire length of said channel and a vaporizable coolant liquid within said channel; - and
wherein the solid dielectric mass comprises first and second opposing slabs of dielectric material, opposing planar surfaces of said first and second opposing slabs comprising electrically conductive surfaces in contact with each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 18, 19)
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10. An arrangement comprising:
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a solid dielectric mass enclosing a heat-producing electrical element, the solid dielectric mass defining an elongated channel, a heat pipe consisting of said elongated channel, the heat pipe further being in thermal communication with the electrical element, wherein the inner surface of the heat pipe is said solid dielectric mass, wherein said heat pipe further comprises a wick extending along substantially the entire length of said channel, and a vaporizable coolant liquid disposed within said channel; and wherein the solid dielectric mass comprises first and second opposing slabs of dielectric material, opposing planar surfaces of said first and second opposing slabs comprising electrically conductive surfaces in contact with each other. - View Dependent Claims (11, 12, 13, 14, 20, 21)
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15. An arrangement comprising:
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a solid dielectric mass enclosing a heat-producing electrical element, the solid dielectric mass defining an elongated channel, a heat pipe consisting of said elongated channel, the heat pipe further being in thermal communication with the electrical element, wherein the solid dielectric mass is comprised of first and second opposing slabs of dielectric material, opposing planar surfaces of said first and second opposing slabs comprising electrically conductive surfaces in contact with each other; wherein a first portion of the elongated channel is formed in the first opposing slab and a second portion of the elongated channel is formed in the second opposing slab, and wherein the first and second portions are registered when the first and second opposing slabs are juxtaposed to form the elongated channel; wherein the inner surface of the elongated channel is said solid dielectric mass, and wherein said heat pipe further comprises a wick extending along substantially the entire length of said channel, and a vaporizable coolant liquid disposed within said channel. - View Dependent Claims (16, 17, 22, 23)
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Specification