Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light

• US 7,866,853 B2
• Filed: 11/28/2008
• Issued: 01/11/2011
• Est. Priority Date: 11/19/2004
• Status: Expired due to Fees

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Ito, Masanori, Ohashi, Masakazu, Uruga, Ken-ichi
• Primary Examiner(s): O Shea; Sandra L
• Assistant Examiner(s): ALLEN, DANIELLE NICOLE
• Application Number:
  US12/325,113
• Publication Number:
  US 20090122554A1
• Time in Patent Office: 774 Days
• Field of Search: 362/226, 362/249, 362/240, 362/241, 362/296.01, 362/297, 362/299, 362/300, 362/301, 362/307, 362/310, 362/296.04, 362/326, 362/327, 362/329, 362/330, 362/294
• US Class Current: 362/296.01
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The present invention provides a light-emitting element mounting substrate which includes: a core metal provided with a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction; and an enamel layer having a thickness within a range of 50 μm to 200 μm, and provided on a surface of the core metal. The present invention also provides a light-emitting element module in which a light-emitting element is provided on this light-emitting element mounting substrate, and in which the light-emitting element is sealed with a transparent sealing resin.

Claims

1. A light-emitting element mounting substrate comprising:

a reflective cup formed in a core metal which reflects light emitted from a mounted light-emitting element in a prescribed direction;

an enamel layer having a thickness within a range of 50 μ

m to 200 μ

m, and provided on a surface of the core metal and the reflective cup; and

wherein the enamel layer covers the surface of the core metal and reflective cup.

2. The light-emitting element mounting substrate according to claim 1, wherein a groove is provided at a circumferential edge of a bottom part of the reflective cup.

3. A light-emitting element module which mounts a light-emitting element on the light-emitting element mounting substrate according to claim 1 or 2, wherein the light-emitting element is sealed with transparent sealing resin.

4. The light-emitting module according to claim 3, wherein the light-emitting element is a white light-emitting diode that is formed by mixing fluorescent material into the sealing resin, and emits white light.

10. A display device comprising the light-emitting element module according to claim 3.

11. A lighting device comprising the light-emitting element module according to claim 4.

12. A traffic light comprising the light-emitting element module according to claim 3.

5. A method of manufacturing a light-emitting element mounting substrate, the method comprising:

forming a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction, at a predetermined position on a core metal;

subsequently applying and baking enamel material on a surface of the core metal and the reflective cup, to form an enamel layer which has a thickness within a range of 50 μ

m to 200 μ

m on the surface of the core metal and the reflective cup; and

wherein the enamel layer covers the surface of the core metal and reflective cup.

6. The method of manufacturing a light-emitting element mounting substrate according to claim 5, wherein enamel material whose primary component is glass, is electro deposited onto the surface of the core metal and the reflective cup, and baking is subsequently conducted.

7. A method of manufacturing a light-emitting element module, the method comprising:

forming a light-emitting element mounting substrate by forming a reflective cup which reflects light emitted from a mounted light-emitting element in a prescribed direction, at a predetermined position on a core metal, and subsequently applying and baking enamel material on a surface of the core metal and the reflective cup, to form an enamel layer which has a thickness within a range of 50 μ

m to 200 μ

m on the surface of the core metal and the reflective cup, wherein the enamel layer covers the surface of the core metal and reflective cup;

subsequently forming electrodes on the surface of the light-emitting element mounting substrate;

subsequently mounting a light-emitting element onto the electrode at the center portion of the reflective cup so as to electrically connect the electrode and the light-emitting element; and

subsequently filling the reflective cup with resin and curing the resin to seal the light-emitting element.

8. The method of manufacturing a light-emitting element module according to claim 7, wherein the light-emitting element is sealed by resin which is intermixed with fluorescent material.

9. The method of manufacturing a light-emitting element module according to claim 8, wherein the light-emitting element is a blue light emitting diode, and the fluorescent material is a blue-excited yellow-emitting fluorescent material.