Porous substrate plates and the use thereof

• US 7,867,700 B2
• Filed: 10/11/2007
• Issued: 01/11/2011
• Est. Priority Date: 04/12/2004
• Status: Expired due to Fees

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Hong, Yulong, Ferrie, Ann M., Webb, Brian L., Fang, Ye
• Primary Examiner(s): Chin; Christopher L
• Application Number:
  US11/870,742
• Publication Number:
  US 20080119370A1
• Time in Patent Office: 1,188 Days
• Field of Search: None
• US Class Current: 435/4
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/069 Absorbents; Gels to retain a fluid
• CPC Class Codes: B01L 2300/0829 Multi-well plates; Microtitration plates
• CPC Class Codes: B01L 3/5085 for multiple samples, e.g. microtitration plates
• CPC Class Codes: Y10S 435/81 Packaged device or kit
• CPC Class Codes: Y10S 436/809 Multifield plates or multicontainer arrays
• CPC Class Codes: Y10T 29/49885 with coating before or during assembling

Abstract

A substrate plate or device adapted for use with biological or chemical assays is disclosed. The device may take the form of a multi-well plate having a three-dimensional, porous layer as part of a support surface within each well for immobilizing probe species. The porous layer is characterized as having a plurality of interconnected voids defined by a matrix of contiguous solid material. A method and its variants are also described.

Claims

1. A method of making a substrate used in a microplate, the method comprises the following steps:

providing a template for forming a number of porous patches;

providing a flat, rigid, non-porous understructure; and

applying within said template a layer of material with granular particles to a top surface of the inorganic understructure.

2. The method according to claim 1, wherein said template serves as an adaptor that defines the location of each porous patch so as to correspond with an arrangement of wells in said microplate.

3. The method according to claim 1, wherein said granular particles are consolidated to form a porous wafer attached to said understructure.

4. A method for manufacturing a support plate, the method comprises:

providing an organic or polymeric layer formed from individual granular particles that are adhered together to form a porous matrix;

placing said porous layer on a understructure support plate; and

attaching said porous layer to said understructure support plate by means of applying pressure and either (a) a thermal bond using a heated platen or adaptor with the configuration of a microplate, or (b) adhesive chemistry using a “

stamp”

adaptor with the same configurations of a microplate, where in either approach (a) or (b) a section of the porous layer will be separated from other areas.