Method of fabricating power semiconductor device

• US 7,867,854 B2
• Filed: 07/23/2009
• Issued: 01/11/2011
• Est. Priority Date: 05/08/2009
• Status: Expired due to Fees

• Current Assignee: Anpec Electronics Corporation
• Original Assignee: Anpec Electronics Corporation
• Inventors: Hsu, Hsin-Yu, Yeh, Jen-Hao, Yang, Guo-Liang, Lin, Wei-Chieh
• Primary Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US12/507,808
• Publication Number:
  US 20100285646A1
• Time in Patent Office: 537 Days
• Field of Search: 438/270, 438/271, 438/272, 438/589, 438/268, 438/274, 257/E21.428
• US Class Current: 438/270
• CPC Class Codes: H01L 21/26513 of electrically active species
• CPC Class Codes: H01L 21/26586 characterised by the angle between the ion beam and the crystal planes or the main crystal surface
• CPC Class Codes: H01L 29/1095 Body region, i.e. base region, of DMOS transistors or IGBTs cell layout H01L29/0696
• CPC Class Codes: H01L 29/4236 within a trench, e.g. trench gate electrode, groove gate electrode
• CPC Class Codes: H01L 29/66727 with a step of recessing the source electrode
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7811 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

Wider and narrower trenches are formed in a substrate. A first gate material layer is deposited but not fully fills the wider trench. The first gate material layer in the wider trench and above the substrate original surface is removed by isotropic or anisotropic etching back. A first dopant layer is formed in the surface layer of the substrate at the original surface and the sidewall and bottom of the wider trench by tilt ion implantation. A second gate material layer is deposited to fully fill the trenches. The gate material layer above the original surface is removed by anisotropic etching back. A second dopant layer is formed in the surface layer of the substrate at the original surface by ion implantation. The dopants are driven-in to form a base in the substrate and a bottom-lightly-doped layer surrounding the bottom of the wider trench and adjacent to the base.

Claims

1. A method of fabricating power semiconductor device, comprising:

providing a substrate having an original top surface and a bottom surface;

etching the substrate through a first mask to form a first trench and at least a second trench, wherein a width of the first trench is greater than a width of the at least a second trench;

forming a gate insulating layer all over the substrate to cover the original top surface and sidewalls and bottoms of the first trench and the at least a second trench;

performing a first deposition process to form a first gate material layer all over the gate insulating layer, wherein the first trench is not fully filled with the first gate material layer;

performing an isotropic or anisotropic etching back process to remove the first gate material layer within the first trench and above the original top surface of the substrate;

performing a tilt ion implantation process all over the substrate to form a first dopant layer in a surface layer of the substrate, the surface layer of the substrate comprising a surface layer of the original top surface of the substrate and a surface layer of the sidewall and the bottom of the first trench;

performing a second deposition process all over the substrate to form a second gate material layer, wherein, the first gate material layer combines the second gate material layer to form a gate material layer, and the gate material layer fills up the first trench and the at least a second trench and covers the gate insulation layer on the original top surface of the substrate;

performing an anisotropic etching back process to partially remove the gate material layer, thereby exposing the gate insulation layer on the original top surface of the substrate;

performing a first ion implantation all over the substrate to form a second dopant layer in a surface of the original top surface of the substrate; and

performing a drive-in process to extend the distribution of the dopants of the first dopant layer and the second dopant layer in the substrate, thereby to form a base in the substrate and to form a bottom-lightly-doped layer surrounding a bottom of the first trench and adjacent to the base.

2. The method of claim 1, wherein the first dopant layer comprises a p type dopant.

3. The method of claim 1, wherein the second dopant layer comprises a p type dopant.

4. The method of claim 1, wherein the gate material layer comprises a doped polysilicon.

5. The method of claim 1, wherein the substrate comprises a semiconductor wafer substrate and a semiconductor layer formed on the semiconductor wafer substrate.

6. The method of claim 5, wherein the semiconductor layer comprises an n type lightly doped epitaxial layer.

7. The method of claim 5, wherein the semiconductor wafer substrate comprises an n type heavily doped region.

8. The method of claim 1, wherein the base comprises a p type base.

9. The method of claim 1, wherein the bottom-lightly-doped layer comprises a p type lightly doped layer.

10. The method of claim 1, further performing a second ion implantation through a second mask to form at least a source region on the base.

11. The method of claim 10, wherein the base comprises at least a contact plug predetermined region, and further performing a third ion implantation through a third mask to form a heavily doped region on the at least a contact plug predetermined region.

12. The method of claim 11, further forming an interlayer dielectric all over the substrate, forming at least a source contact plug throughout the at least a source region and the interlayer dielectric, forming a gate contact plug throughout the interlayer dielectric, and forming at least a source metal layer and a gate metal layer on the interlayer dielectric, wherein the at least a source contact plug electrically connects the at least a heavily doped region and the at least a source metal layer, and the gate contact plug electrically connects the gate material layer within the first trench and the gate metal layer.

13. The method of claim 10, further forming a drain metal layer on the bottom surface of the substrate.