High-voltage semiconductor device and method of fabricating the same
First Claim
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1. A high-voltage semiconductor device comprising:
- a semiconductor layer including a top surface, a bottom surface, and a plurality of pillars of a first conductivity type defined by a plurality of trenches, wherein the trenches extend from the top surface of the semiconductor layer toward the bottom surface thereof;
a charge compensation layer of a second conductivity type disposed over at least sidewalls of each trench to a predetermined thickness to form a groove in each trench; and
a charge compensation plug of the first conductivity type substantially filling each groove,wherein sidewalls of each trench are slanted.
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Abstract
A high-voltage semiconductor device includes a semiconductor layer having a plurality of pillars of a first conductivity type defined by a plurality of trenches which extend from a top surface of the semiconductor layer toward a bottom surface thereof. A charge compensation layer of a second conductivity type is disposed over at least sidewalls of each trench to a predetermined thickness to form a groove in each trench. A charge compensation plug of the first conductivity type substantially fills each groove.
38 Citations
42 Claims
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1. A high-voltage semiconductor device comprising:
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a semiconductor layer including a top surface, a bottom surface, and a plurality of pillars of a first conductivity type defined by a plurality of trenches, wherein the trenches extend from the top surface of the semiconductor layer toward the bottom surface thereof; a charge compensation layer of a second conductivity type disposed over at least sidewalls of each trench to a predetermined thickness to form a groove in each trench; and a charge compensation plug of the first conductivity type substantially filling each groove, wherein sidewalls of each trench are slanted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A high-voltage semiconductor device comprising:
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a semiconductor layer including a top surface, a bottom surface; a plurality of trenches in the semiconductor layer, each adjacent pair of trenches defining a mesa region therebetween; a pillar of a first conductivity type in each mesa region between every two adjacent trenches; a charge compensation impurity layer of a second conductivity type vertically extending in each mesa region between each pillar and an adjacent trench sidewall; and a charge compensation plug of the first conductivity type substantially filling each trench, wherein sidewalls of each trench are slanted. - View Dependent Claims (17, 18, 19, 20, 21)
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22. A high-voltage semiconductor device comprising:
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a semiconductor layer including a top surface, a bottom surface, and a plurality of pillars of a first conductivity type defined by a plurality of trenches, wherein the trenches extend from the top surface of the semiconductor layer toward the bottom surface thereof; a charge compensation layer of a second conductivity type disposed over at least sidewalls of each trench to a predetermined thickness to form a groove in each trench; and a charge compensation plug of the first conductivity type substantially filling each groove, wherein the sum of the amount of charges in the pillars and in the charge compensation plugs is substantially equal to the amount of charges in the charge compensation layer in a depthwise direction of the grooves. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A high-voltage semiconductor device comprising:
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a semiconductor layer including a top surface, a bottom surface; a plurality of trenches in the semiconductor layer, each adjacent pair of trenches defining a mesa region therebetween; a pillar of a first conductivity type in each mesa region between every two adjacent trenches; a charge compensation impurity layer of a second conductivity type vertically extending in each mesa region between each pillar and an adjacent trench sidewall; and a charge compensation plug of the first conductivity type substantially filling each trench, wherein the sum of the amount of charges in the pillars and the charge compensation plugs is substantially equal to the amount of charges in the charge compensation impurity layer in a depthwise direction of the trenches. - View Dependent Claims (38, 39, 40, 41, 42)
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Specification