Electronic module configured for failure containment and system including same

• US 7,869,211 B2
• Filed: 06/28/2007
• Issued: 01/11/2011
• Est. Priority Date: 06/30/2006
• Status: Active Grant

• Current Assignee: Innomotics GmbH
• Original Assignee: Siemens Industry Incorporated (Siemens AG)
• Inventors: Kunkle, Jonathan
• Primary Examiner(s): Vortman; Anatoly
• Application Number:
  US11/769,891
• Publication Number:
  US 20090016018A1
• Time in Patent Office: 1,293 Days
• Field of Search: 361/695, 361/609, 361/611, 361/622, 361/648, 361/690, 361/697, 361/726
• US Class Current: 361/695
• CPC Class Codes: H05K 7/20136 Forced ventilation, e.g. by fans H05K7/202 takes precedence
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

An electronic module. The electronic module includes a chassis, a plurality of capacitors, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The chassis also includes a first side, a second side, a third side, and a fourth side. The second side is opposite the first side. The third side is connected to at least one of the first and second sides. The fourth side is connected to at least one of the first and second sides, and is opposite the third side. The chassis is fabricated from a material which stops component debris from passing through the sides of the chassis. The capacitors are positioned within the chassis. The heat sink is positioned between the capacitors and the second end.

Claims

1. An electronic module, comprising:

a chassis having a first end and a second end opposite the first end, wherein the chassis comprises;

a first side;

a second side opposite the first side;

a third side connected to at least one of the first and second sides; and

a fourth side connected to at least one of the first and second sides, wherein the fourth side is opposite the third side;

a plurality of capacitors positioned within the chassis;

a plurality of bus bars positioned within the chassis and operably connected to the plurality of capacitors, wherein the plurality of bus bars comprises at least one input bus bar and at least one output bus bar;

a plurality of power plug connectors, wherein each of the plurality of bus bars further comprises at least one power plug connector configured to establish a connection between the bus bar and a system bus, thereby operably connecting the electronic module and the system bus; and

a heat sink positioned between the capacitors and the second end, wherein the chassis is fabricated from a material having a thickness and resulting strength such that component debris located within the chassis is prevented from passing through the sides of the chassis, wherein the component debris comprises at least a portion of a failed component positioned within the chassis.

2. The electronic module of claim 1, wherein the material is a metal.

3. The electronic module of claim 2, wherein the metal is galvanized steel.

4. The electronic module of claim 1, wherein a portion of one of the sides is hingedly connected to the chassis.

5. The electronic module of claim 1, wherein at least one of the capacitors is an electrolytic capacitor.

6. The electronic module of claim 1, wherein the heat sink is fabricated from a thermally conductive material.

7. The electronic module of claim 6, wherein the thermally conductive material is aluminum.

8. The electronic module of claim 1, wherein the heat sink comprises spaced-apart fins which stop at least some of the component debris from passing therebetween.

9. The electronic module of claim 1, further comprising a capacitor tray positioned between the capacitors and one of the sides of the chassis, wherein the capacitor tray is fabricated from a material having a thickness and resulting strength such that the capacitor tray stops at least some of the component debris from passing therethrough.

10. The electronic module of claim 9, further comprising a control board positioned between the capacitor tray and one of the sides of the chassis.

11. The electronic module of claim 1, further comprising a deflector positioned between the capacitors and the second end, wherein the deflector is fabricated from a material having a thickness and resulting strength such that the deflector stops at least some of the component debris from passing therethrough.

12. The electronic module of claim 1, further comprising a first switching device positioned between the heat sink and one of the sides of the chassis.

13. The electronic module of claim 12, further comprising a second switching device positioned between the heat sink and the one of the sides of the chassis.

14. The electronic module of claim 1, further comprising a resistor positioned between the deflector and the second end.

15. A system, comprising:

a fan; and

an electronic module, wherein the electronic module comprises;

a chassis having a first end and a second end opposite the first end, wherein the chassis comprises;

a first side;

a second side opposite the first side;

a third side connected to at least one of the first and second sides; and

a fourth side connected to at least one of the first and second sides,

wherein the fourth side is opposite the third side;

a plurality of capacitors positioned within the chassis;

a plurality of bus bars positioned within the chassis and operably connected to the plurality of capacitors, wherein the plurality of bus bars comprises at least one input bus bar and at least one output bus bar;

a plurality of power plug connectors, wherein each of the plurality of bus bars further comprises at least one power plug connector configured to establish a connection between the bus bar and a system bus, thereby operably connecting the electronic module and the system bus; and

a heat sink positioned between the capacitors and the second end, wherein the heat sink is positioned such that when the fan generates an airflow, the airflow carries component debris located within the chassis toward the heat sink, wherein the component debris comprises at least a portion of a failed component positioned within the chassis.

16. The system of claim 15, wherein the chassis is fabricated from a material having a thickness and resulting strength such that the chassis stops component debris from passing through the sides thereof.

17. The system of claim 15, wherein the heat sink comprises spaced-apart fins which stop at least some of the component debris from passing therebetween.

18. The system of claim 15, wherein the electronic module further comprises a capacitor tray positioned between the capacitors and one of the sides of the chassis, wherein the capacitor tray is fabricated from a material having a thickness and resulting strength such that the capacitor tray stops at least some of the component debris from passing therethrough.

19. The system of claim 18, wherein the electronic module further comprises a control board positioned between the capacitor tray and one of the sides of the chassis.

20. The system of claim 15, wherein the electronic module further comprises a deflector positioned between the capacitors and the second end, wherein the deflector is fabricated from a material having a thickness and resulting strength such that the deflector stops at least some of the component debris from passing therethrough.