Circuit board device for information apparatus, multilayered module board and navigation system

• US 7,869,223 B2
• Filed: 04/09/2003
• Issued: 01/11/2011
• Est. Priority Date: 04/09/2002
• Status: Expired due to Fees

• Current Assignee: Clarion Co., Ltd. (Faurecia SA)
• Original Assignee: Xanavi Informatics Corporation (Hitachi, Ltd.)
• Inventors: Miyazawa, Hirohisa
• Primary Examiner(s): Dinh; Tuan T
• Application Number:
  US10/510,567
• Publication Number:
  US 20050156306A1
• Time in Patent Office: 2,834 Days
• Field of Search: 701 50- 51, 361760-764, 361790-795
• US Class Current: 361/790
• CPC Class Codes: G01C 21/26 specially adapted for navigation in a road network
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10159 Memory
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence

Abstract

A multilayered module board with mounted high-frequency electronic components such as a CPU and a graphic circuit is mounted on one face of a base board with mounted low-frequency electronic components. The multilayered module board is a squared multilayered board smaller than the base board. The electronic components are wired with an inner layer-wiring pattern. Connector terminals are solder-jointed to four sides of the multilayered module board. The multilayered module board is mounted to the base board via the connector terminal.

Claims

1. A circuit board device for an information apparatus comprising:

a base board having mounted thereupon a plurality of low-frequency electronic components; and

a multilayer module board mounted at one surface of the base board and having mounted thereupon a plurality of high-frequency electronic components including at least a CPU and a memory, wherein;

the multilayer module board is one of (i) a low-end module board, (ii) a high-speed module board that operates at higher speed than the low-end module board or (iii) an advanced function module board having more functions than the low-end module board; and

the base board is configured to accept interchangeably a connection with a multilayer board that is (i) the low-end module board, (ii) the high-speed module board and (iii) the advanced function module board,

the plurality of high-frequency electronic components including a CPU and a memory mounted at, at least, a surface thereof,

the plurality of high-frequency electronic components are connected with one another through a wiring patterns formed at an inner layer thereof, and

an overall shape of the multilayer module board is rectangular and the multilayer module board comprises four connector terminals provided as separate members each soldered onto one of four peripheral edges thereof.

2. A navigation system comprising a circuit board device for an information apparatus according to claim 1.

3. The multilayer module board according to claim 1, wherein:

the four connector terminals each include a narrow, elongated base portion constituted of resin and a plurality of pins fixed to the base portion; and

the four connector terminals are each carried with the base portion attached to a transfer adapter and the four connector terminals are connected through soldering onto a rear surface of the board while attached to the transfer adapter.

4. The multilayer module board according to claim 1, wherein:

the four connector terminals each include

a narrow, elongated base portion constituted of resin;

a plurality of pins fixed to the base portion;

aligning pins projecting at both ends of the base portion to be used when soldering the connector terminal onto a rear surface of the board; and

inclined surfaces for position control formed at both ends of the base portion to be used when soldering the connector terminal;

a pair of positioning holes at which the aligning pins are loosely fitted are formed at each of four corners of the board; and

positions of the connector terminals are controlled when soldering the connector terminals as the inclined surfaces for position control at adjacent connector terminals come into contact with each other while the aligning pins are loosely fitted at the positioning holes.

5. A circuit board device, comprising:

a base board; and

a multilayer module board mounted on the base board, the multilayer module board comprising;

a plurality of high-frequency electronic components including a CPU and a memory mounted at, at least, a surface thereof, wherein;

the plurality of high-frequency electronic components are connected with one another through a wiring pattern formed at an inner layer thereof;

an overall shape of the multilayer module board is rectangular and the multilayer module board comprises four connector terminals provided as separate members each soldered onto one of four peripheral edges thereof;

the four connector terminals each include a narrow, elongated base portion constituted of resin and a plurality of pins fixed to the base portion; and

after the four connector terminals are each carried with the base portion attached to a transfer adapter, the four connector terminals are connected through soldering onto a rear surface of the board while attached to the transfer adapter.

6. A circuit board device, comprising:

a base board; and

a multilayer module board mounted on the base board, the multilayer module board comprising;

a plurality of high-frequency electronic components including a CPU and a memory mounted at, at least, one surface thereof, wherein;

the plurality of high-frequency electronic components are connected with one another through a wiring pattern formed at an inner layer thereof;

an overall shape of the multilayer module board is rectangular and the multilayer module board comprises four connector terminals provided as separate members each soldered onto one of four peripheral edges thereof;

the four connector terminals each include

a narrow, elongated base portion constituted of resin;

a plurality of pins fixed to the base portion;

aligning pins projecting at both ends of the base portion to be used when soldering the connector terminal onto a rear surface of the board; and

inclined surfaces for position control formed at both ends of the base portion to be used when soldering the connector terminal;

a pair of positioning holes at which the aligning pins are loosely fitted are formed at each of four corners of the board; and

positions of the connector terminals are controlled when soldering the connector terminals as the inclined surfaces for position control at adjacent connector terminals come into contact with each other while the positioning pins are loosely fitted at the positioning holes.