Hybrid sensor module and sensing method using the same

• US 7,870,678 B2
• Filed: 09/06/2007
• Issued: 01/18/2011
• Est. Priority Date: 09/06/2006
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Won Tae, Kwon, Kyoung Soo, Kwon, Oh Jo
• Primary Examiner(s): GUADALUPE, YARITZA
• Application Number:
  US11/896,908
• Publication Number:
  US 20080052931A1
• Time in Patent Office: 1,230 Days
• Field of Search: 333/56, 333/55.R, 333/61
• US Class Current: 33/355.00R
• CPC Class Codes: G01C 17/28 Electromagnetic compasses with north seeking magnetic elements and having electric pick-offs G01C17/26
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10484 Obliquely mounted

Abstract

Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.

Claims

1. A hybrid sensor module comprising:

first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB;

a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle θ

from a vertical direction of the PCB in a direction where the first sensor is positioned, the third sensor detecting a signal component sensed in the axial direction; and

a signal correction unit that is connected to the first, the second, and the third sensors and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system by using the following equation;

2. A hybrid sensor module comprising:

first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB;

a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle φ

from a vertical direction of the PCB in a direction where the second sensor is positioned, the third sensor detecting a signal component sensed in the axial direction; and

a signal correction unit that is connected to the first, the second, and the third sensors and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system by using the following equation;

3. A sensing method using a hybrid sensor module, the sensing method comprising:

detecting signal components sensed from first and second sensors, which are disposed in parallel to a PCB, and a third sensor of which the axial direction is tilted at a predetermined angle θ

from a vertical direction of the PCB in a direction where the first sensor is positioned; and

correcting the signal components detected at the detecting signal components into signal components of an orthogonal coordinate system by using the following equation;

4. A sensing method using a hybrid sensor module, the sensing method comprising the steps of:

detecting signal components sensed from first and second sensors, which are disposed in parallel to a PCB, and a third sensor of which the axial direction is tilted at a predetermined angle φ

from a vertical direction of the PCB in a direction where the second sensor is positioned; and

correcting signal components detected at the detecting signal components into signal components of an orthogonal coordinate system by using the following equation;