Wireless IC device and manufacturing method thereof
First Claim
1. A wireless IC device comprising:
- a radiation plate;
a wireless IC chip; and
a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;
whereinthe substrate is made of a resin material and includes a recess in a first main surface thereof;
the substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and on the first main surface of the substrate, the wiring electrode being electrically connected to the feed circuit;
the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode;
the wireless IC chip is mounted in the recess and coupled to the wiring electrode; and
the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless IC device includes a radiation plate, a wireless IC chip, and a substrate provided with a feed circuit that includes a resonant circuit and/or the matching circuit including an inductance element and that is electromagnetically coupled to the radiation plate. The substrate is made of a resin material. A recess is provided in a first main surface of the substrate. The substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and the first main surface of the substrate and electrically connected to the feed circuit, and a wedge member made of a different material from the resin material and extending between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode. The wireless IC chip is mounted in the recess and coupled to the wiring electrode.
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Citations
18 Claims
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1. A wireless IC device comprising:
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a radiation plate; a wireless IC chip; and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;
whereinthe substrate is made of a resin material and includes a recess in a first main surface thereof; the substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and on the first main surface of the substrate, the wiring electrode being electrically connected to the feed circuit; the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode; the wireless IC chip is mounted in the recess and coupled to the wiring electrode; and the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a recess in the substrate made of a resin material by pressing a portion of a first main surface of the substrate and a portion of a wiring electrode, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; forming a wedge member using a different material from the resin material such that the wedge member extends between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode; and mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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8. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit, using a different material from the resin material; forming a recess in the substrate by pressing a portion of the first main surface of the substrate, a portion of the wiring electrode, and the wedge member, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate; and mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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9. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, using a different material different from the resin material, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; and forming a recess, in which the wireless IC chip is to be embedded, on the substrate by pressing the wireless IC chip against the first main surface of the substrate in a state in which the wireless IC chip is mounted on the first main surface of the substrate such that the wireless IC chip is opposed to the wiring electrode on the substrate, so that the wiring electrode extends along a bottom surface and an inner circumferential surface of the recess, and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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10. A wireless IC device comprising:
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a radiation plate; a wireless IC chip; and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate;
whereinthe substrate is made of a resin material and includes a recess in a first main surface thereof; the substrate is provided with a wiring electrode arranged along a bottom surface of the recess and on the first main surface of the substrate, the wiring electrode being electrically connected to the feed circuit; the substrate is provided with a wedge member made of a different material from that of the resin material, the wedge member extending between the bottom surface of the recess and a second main surface of the substrate so as to be spaced apart from the wiring electrode; the wireless IC chip is mounted in the recess and coupled to the wiring electrode; and the wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a recess in the substrate made of a resin material by pressing a portion of a first main surface of the substrate and a portion of a wiring electrode, so that the wiring electrode extends along a bottom surface of the recess, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; forming a wedge member using a different material from the resin material such that the wedge member extends between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode; and mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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17. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit, using a different material from the resin material; forming a recess in the substrate by pressing a portion of the first main surface of the substrate, a portion of the wiring electrode, and the wedge member, so that the wiring electrode extends along a bottom surface of the recess and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate; and mounting the wireless IC chip in the recess so as to couple the wireless IC chip to the wiring electrode;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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18. A method for manufacturing a wireless IC device including a radiation plate, a wireless IC chip, and a substrate on which the wireless IC chip is mounted, the substrate being provided with a feed circuit, the feed circuit including at least one of a resonant circuit or a matching circuit, the at least one of the resonant circuit or the matching circuit including an inductance element, the feed circuit being electromagnetically coupled to the radiation plate, the method comprising the steps of:
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forming a wedge member such that the wedge member extends between a first main surface of the substrate made of a resin material and a second main surface thereof spaced apart from a wiring electrode, using a different material different from the resin material, the wiring electrode being formed in advance on the first main surface of the substrate and connected to the feed circuit; and forming a recess, in which the wireless IC chip is to be embedded, on the substrate by pressing the wireless IC chip against the first main surface of the substrate in a state in which the wireless IC chip is mounted on the first main surface of the substrate such that the wireless IC chip is opposed to the wiring electrode on the substrate, so that the wiring electrode extends along a bottom surface of the recess, and so that the wedge member extends between the bottom surface of the recess and the second main surface of the substrate;
whereinthe wedge member is arranged to prevent return-deformation of portions of the substrate close to the recess.
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Specification