Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

• US 7,871,839 B2
• Filed: 01/11/2010
• Issued: 01/18/2011
• Est. Priority Date: 06/30/2004
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Optodevice Company Limited (Seoul Semiconductor Co., Ltd.)
• Inventors: Lee, Keon-Young, Yves, Lacroix, Lee, Chung-Hoon
• Primary Examiner(s): Kebede; Brook
• Application Number:
  US12/685,145
• Publication Number:
  US 20100109031A1
• Time in Patent Office: 372 Days
• Field of Search: 257/88, 257 94- 95, 257 99-100, 257/E25.032, 438/34, 438/142, 438/197, 438/237, 438/FOR.157
• US Class Current: 438/34
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 45/36 Circuits for reducing or suppressing harmonics, ripples or electromagnetic interferences [EMI]
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05B 45/42 Antiparallel configurations

Abstract

The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

Claims

1. A method of manufacturing a light emitting diode, the method comprising:

forming a plurality of light emitting cells on a first substrate;

removing the first substrate after the light emitting cells are formed;

disposing a plurality of electrodes on a second substrate; and

coupling the plurality of light emitting cells using the electrodes.

2. The method of claim 1, wherein forming the plurality of light emitting cells comprises:

growing a first-type semiconductor layer and a second-type semiconductor layer on the first substrate; and

separating the first-type semiconductor layer and the second-type semiconductor layer on the first substrate into individual cells.

3. The method of claim 2, wherein coupling the plurality of light emitting cells comprises:

respectively bonding the plurality of electrodes disposed on the second substrate to the first-type semiconductor layer of each of the plurality of light emitting cells;

removing the first substrate; and

coupling the second-type semiconductor layer of each of the plurality of light emitting cells to the electrode of the adjacent light emitting cell using an air-bridge process or step cover process.