Method and apparatus for manufacturing stacked-type semiconductor device
First Claim
1. A method of manufacturing a stacked-type semiconductor device, comprising:
- arranging a plurality of chip stacks obtained by stacking semiconductor chips on a plurality of stages in one surface direction on a support substrate;
setting the plurality of chip stacks at a preliminary temperature;
heating each of the plurality of chip stacks in sequence at a temperature higher than the preliminary temperature, and connecting a semiconductor chip of each stage in each heated chip stack and the support substrate by wire;
performing plastic molding of each chip stack; and
separating the chip stacks from each other,wherein the heating in units of chip stacks is performed by divided heater blocks arranged with respect to the chip stacks.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate; connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips; performing plastic molding of each stacked chip; and separating the stacked chips from each other; an apparatus for manufacturing a stacked-type semiconductor device, comprising divided heater blocks formed under a support substrate on which a plurality of stacked chips obtained by stacking a plurality of semiconductor chips are arranged, the divided heater blocks being formed with respect to the stacked chips, and a heating device to selectively transmit heat to a stacked chip subjected to a wire bonding.
-
Citations
3 Claims
-
1. A method of manufacturing a stacked-type semiconductor device, comprising:
-
arranging a plurality of chip stacks obtained by stacking semiconductor chips on a plurality of stages in one surface direction on a support substrate; setting the plurality of chip stacks at a preliminary temperature; heating each of the plurality of chip stacks in sequence at a temperature higher than the preliminary temperature, and connecting a semiconductor chip of each stage in each heated chip stack and the support substrate by wire; performing plastic molding of each chip stack; and separating the chip stacks from each other, wherein the heating in units of chip stacks is performed by divided heater blocks arranged with respect to the chip stacks. - View Dependent Claims (2, 3)
-
Specification