Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same
First Claim
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1. A method for planarizing a metal layer, comprising:
- forming control circuitry on or in a semiconductor substrate;
depositing a photoresist layer over the semiconductor substrate;
forming a metal layer over the photoresist layer; and
planarizing the metal layer using a chemical mechanical planarization process to leave a planarized metal layer extending over the photoresist layer.
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Abstract
The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.
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Citations
22 Claims
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1. A method for planarizing a metal layer, comprising:
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forming control circuitry on or in a semiconductor substrate; depositing a photoresist layer over the semiconductor substrate; forming a metal layer over the photoresist layer; and planarizing the metal layer using a chemical mechanical planarization process to leave a planarized metal layer extending over the photoresist layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for manufacturing a micro pixel array, comprising:
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forming control circuitry on or in a semiconductor substrate; forming a hinge over the control circuitry; forming a photoresist layer over the hinge; forming a metal layer over the photoresist layer, the metal layer having a surface roughness; and planarizing the metal layer using a chemical mechanical planarization process, the planarizing reducing the surface roughness and leaving a planarized metal layer extending over the photoresist layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification