Microelectromechanical device packages with integral heaters

• US 7,872,338 B2
• Filed: 11/07/2008
• Issued: 01/18/2011
• Est. Priority Date: 05/22/2003
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Tarn, Terry
• Primary Examiner(s): Louie; Wai-Sing
• Application Number:
  US12/266,789
• Publication Number:
  US 20090072380A1
• Time in Patent Office: 802 Days
• Field of Search: 257/680, 257/686, 257/690, 257/703, 257/704, 257/E23.081, 257/E31.131, 438/660, 438/663
• US Class Current: 257/680
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0181 Using microheaters for bonding the lid
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.

Claims

1. A device package, comprising:

a package substrate having first substrate layer and second substrate layer;

a cover;

a glass frit proximate the cover and the second substrate layer; and

a heater laminated between the first and second substrate layers proximate the glass frit, the heater operable to fuse the glass frit to the cover and second substrate layer.

2. The package of claim 1, wherein the first and second substrate layers are ceramic materials.

3. The package of claim 1, further comprising:

a microelectromechanical system device attached to the package substrate.

4. The package of claim 1, further comprising:

an image detector or image sensor device attached to the package substrate.

5. The package of claim 1, further comprising:

a CCD device attached to the package substrate.

6. The package of claim 3, wherein the microelectromechanical system device is a micromirror array device having an array of deflectable reflective mirror plates.

7. The package of claim 6, wherein the mirror plates are enclosed within a space between a device substrate that is transmissive to visible light and a semiconductor device substrate.

8. The package of claim 7, wherein the semiconductor device substrate comprises an array of electrodes for deflecting the mirror plates.

9. The package of claim 6, further comprising:

a package cover substrate that is transmissive to visible light and is bonded to the package substrate such that the micromirror array device is enclosed within a space between the package cover and the package substrate.

10. The package of claim 1, wherein the package cover substrate is hermetically bonded to the package substrate.

11. The package of claim 1, further comprising:

a spatial light modulator device attached to the package substrate.