Method for the soldering repair of a component in a vacuum and an adjusted partial oxygen pressure
First Claim
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1. A method for a soldering repair of a component, comprising the steps of:
- repairing the component by soldering the component with a solder in a processing chamber, wherein the soldering includes;
adjusting an oxygen partial pressure of less than 3.5*10−
6 mbar and greater than 10−
7 mbar in the processing chamber; and
adjusting a total process pressure of less than 10 mbar and greater than 0.035 mbar in the processing chamber.
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Abstract
A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.
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16 Claims
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1. A method for a soldering repair of a component, comprising the steps of:
repairing the component by soldering the component with a solder in a processing chamber, wherein the soldering includes; adjusting an oxygen partial pressure of less than 3.5*10−
6 mbar and greater than 10−
7 mbar in the processing chamber; andadjusting a total process pressure of less than 10 mbar and greater than 0.035 mbar in the processing chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
Specification