Method of manufacturing RFID devices

• US 7,874,493 B2
• Filed: 05/29/2009
• Issued: 01/25/2011
• Est. Priority Date: 12/22/2005
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Munn, Jason D., Hughen, John F., Kennedy, Steven C., Armijo, Edward A., Linder, Samuel A.
• Primary Examiner(s): Trail; Allyson N
• Application Number:
  US12/474,300
• Publication Number:
  US 20090230198A1
• Time in Patent Office: 606 Days
• Field of Search: 235/492, 340/572.1, 340/572.7
• US Class Current: 235/492
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/1858 using vacuum
• CPC Class Codes: G06K 19/07 with integrated circuit chips
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

Claims

1. A method of making RFID devices, the method comprising:

feeding portions of a free end of an interposer web into a cutter, wherein the feeding includes feeding an interposer of the interposer web and selectively feeding additional material at the free end of the interposer web;

cutting, in an iterative process, the interposer and the additional material, if any, from the free end of the interposer web onto a rotary transport mechanism;

transporting the interposer on the rotary transport mechanism;

transferring the interposer from the rotary transport mechanism to a moving antenna web; and

attaching the interposer to the antenna web, such that the interposer is operatively coupled to an antenna of the antenna web.

2. The method of claim 1, wherein cutting includes using a rotary cutter to cut the interposer onto an anvil of the rotary transport mechanism.

3. The method of claim 2, wherein the rotary cutter includes multiple blades configured for contacting different locations on the free end of the interposer web in a single cutting operation and the multiple blades include a leading blade for cutting the additional material, if any;

and a trailing blade for cutting the interposer.

4. The method of claim 1, including an additional step of testing the interposer web prior to the step of cutting.

5. The method of claim 1, including an additional step of affixing the interposed to the antenna web after the step of attaching by one of curing, bonding, crimping or the like.

6. The method of claim 1, wherein the feeding is done by a variable speed feeder to cyclically feed the free end of the interposer web into the step of cutting.

7. The method of claim 1, including an additional step of singulating interposers after the step of cutting.

8. The method of claim 1, including an additional step of removing failed interposers after the step of cutting.

9. The method of claim 1, including an additional step of positioning the interposer web in a cutting zone prior to the step of cutting.

10. The method of claim 1, including an additional step of applying an adhesive coated release liner to the antenna web after the step of attaching to form an RFID inlay label stock.

17. An RFID device produced in accordance with the method of claim 1.

11. A fabrication system for making an RFID inlay intermediate web for use as label stock, comprising;

an interposer stock having a first pitch, the interposer stock having an integrated circuit provided on a polymeric material;

a transporter for moving the interposer stock;

a cutter for separating the interposer stock into individual interposers;

a tester for testing each of the individual interposers;

a rotary transporter for accepting the individual interposers and moving the individual transporter an antenna web;

an antenna web handler for moving the antenna web in proximity to the rotary transporter to receive the individual interposer, the antenna web along with the interposer form an RFID inlay intermediate web having a second pitch distinct from the first pitch; and

;

adhesive applicator for applying an adhesive and release material to the RFID inlay intermediate web to form an RFID inlay label stock.

12. A system as recited in claim 11, wherein the interposer stock is provided in a roll format.

13. A system as recited in claim 11, wherein the interposer stock is provided in a cut sheet format.

14. A system as recited in claim 11, wherein the second pitch is greater than the first pitch.

15. A system as recited in claim 11, wherein the interposer stock is provided with a plurality of lanes of interposers.

16. A system as recited in claim 11, including a removal chute for discarding failed interposers.