Heat dissipating device for LED light-emitting module
First Claim
1. A heat dissipating device for LED light-emitting module comprising:
- a plurality of fins configured in a radial arrangement, a composite mutual soldering of which forms a heat dissipating unit;
a cavity enabling soldering thereto is configured center of the heat dissipating unit, and a through hole is defined center of the cavity, a cavity side wall of the cavity forms a linear side wall, and a bottom portion of the cavity forms a linear cavity wall;
an LED light-emitting module, comprising;
at least one or more than one light-emitting crystal connected to a baseplate;
a heat dissipating base is provided with a holding space, and a heat conducting layer is packed into a connecting gap between a bottom surface of the holding space and a bottom surface of the baseplate and joined thereto, an outer surface of a bottom portion of the heat dissipating base is soldered to the linear horizontal cavity wall, and an outer peripheral surface of the heat dissipating base is soldered to the linear cavity side wall.
1 Assignment
0 Petitions
Accused Products
Abstract
A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base; The heat dissipating base and the heat dissipating unit are mutually fixedly joined to form an integrated body, and the heat conducting layer is used to uniformly and efficiently transmit heat from the baseplate to the heat dissipating base, whereupon the heat dissipating base then transmits the heat to the heat dissipating unit. Accordingly, the quick and effective direct heat conduction of the heat conducting layer is used to conduct away and dissipate the high temperature produced by the LED, thereby extending serviceable life and improving stability and luminous efficiency of the LED, thus increasing heat dissipation efficiency of the entire LED light-emitting module.
48 Citations
8 Claims
-
1. A heat dissipating device for LED light-emitting module comprising:
-
a plurality of fins configured in a radial arrangement, a composite mutual soldering of which forms a heat dissipating unit;
a cavity enabling soldering thereto is configured center of the heat dissipating unit, and a through hole is defined center of the cavity, a cavity side wall of the cavity forms a linear side wall, and a bottom portion of the cavity forms a linear cavity wall;an LED light-emitting module, comprising; at least one or more than one light-emitting crystal connected to a baseplate;
a heat dissipating base is provided with a holding space, and a heat conducting layer is packed into a connecting gap between a bottom surface of the holding space and a bottom surface of the baseplate and joined thereto, an outer surface of a bottom portion of the heat dissipating base is soldered to the linear horizontal cavity wall, and an outer peripheral surface of the heat dissipating base is soldered to the linear cavity side wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification