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Resin for composite structures

  • US 7,875,675 B2
  • Filed: 11/23/2005
  • Issued: 01/25/2011
  • Est. Priority Date: 11/23/2005
  • Status: Expired due to Fees
First Claim
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1. A resin precursor composition for use in the production of composite components comprising:

  • a mold release material;

    a filler material;

    an isocyanate component comprising a material selected from the group consisting of diphenylmethane diisocyanate, a polymeric isomer of diphenylmethane diisocyanate, and combinations thereof; and

    a blend of three polyether polyols, each of the polyols having a functionality of three in an amount such that the ratio of the isocyanate component to the polyol blend is between approximately 80% and 115% of stoichiometric, the polyether blend comprising;

    (a) between approximately 20% and 50% of a first polyol having a molecular weight of between approximately 600 and 800;

    (b) between approximately 20% and 40% of a second polyol having a molecular weight of between approximately 200 and 300; and

    (c) between approximately 20% and 50% of a third polyol having a molecular weight of between approximately 100 and 300.

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