Semiconductor device including leadframe having power bars and increased I/O

• US 7,875,963 B1
• Filed: 11/21/2008
• Issued: 01/25/2011
• Est. Priority Date: 11/21/2008
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kim, Gi Jeong, Choi, Yeon Ho
• Primary Examiner(s): Clark; Jasmine J
• Application Number:
  US12/276,121
• Time in Patent Office: 795 Days
• Field of Search: 257666-677, 257/691, 257E23031-E23059, 438/111, 438/112, 438/123, 438/FOR.366, 438/FOR.367, 438/FOR.377, 438/FOR.380, 361/813
• US Class Current: 257/670
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49433 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49544 Deformation absorbing parts in the lead frame plane, e.g. meanderline shape H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include bottom surface portions which, in the completed semiconductor package, are exposed and at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body in the completed semiconductor package. The semiconductor package also includes one or more power bars and/or one or more ground rings which are integral portions of the original leadframe used to fabricate the same.

Claims

1. A leadframe for a semiconductor package, comprising:

a generally planar die pad defining multiple peripheral edge segments;

a land connecting bar attached to and at least partially circumventing the die pad;

a dambar attached to and at least partially circumventing the land connecting bar;

a plurality of first leads integrally connected to the land connecting bar and extending inwardly toward the die pad;

a plurality of second leads integrally connected to the dambar, each of the second leads having an inner portion which extends inwardly from the dambar toward the land connecting bar, and an outer portion which extends outwardly from the dambar; and

at least one power bar integrally connected to the land connecting bar and extending between the land connecting bar and the inner portions of at least some of the second leads.

2. The leadframe of claim 1 wherein:

the die pad, the first leads and the connecting bar reside on a first plane;

the power bar resides on a second plane;

the second leads reside on a third plane; and

the first, second and third planes extend in spaced, generally parallel to each other, with the second plane being disposed between the first and third planes.

3. The leadframe of claim 2 wherein:

the die pad has a generally quadrangular configuration;

the first and second leads are segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad; and

a plurality of power bars are integrally connected to the land connecting bar and segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad.

4. The leadframe of claim 3 wherein the power bars are each connected to the land connecting bar by at least one support bar which includes a downset formed therein.

5. The leadframe of claim 4 wherein each of the power bars is integrally connected to at least one of the second leads.

6. The leadframe of claim 5 wherein each of the second leads that is integrally connected to a respective one of the power bars includes a tie bar portion on the inner portion thereof, the tie bar portion being integrally connected to a respective one of the power bars and including a downset formed therein.

7. The leadframe of claim 1 further comprising a plurality a support bars connected to and extending between the die pad and the land connecting bar, each of the support bars being half-etched.

8. A leadframe for a semiconductor package, comprising:

a generally planar die pad defining multiple peripheral edge segments;

a land connecting bar attached to and at least partially circumventing the die pad;

a dambar attached to and at least partially circumventing the land connecting bar;

a plurality of first leads integrally connected to the land connecting bar and extending inwardly toward the die pad;

a plurality of second leads integrally connected to the dambar, each of the second leads having an inner portion which extends inwardly from the dambar toward the land connecting bar, and an outer portion which extends outwardly from the dambar; and

at least one power bar having a first end integrally connected to one of the land connecting bar and one the first leads, and a second end integrally connected to one of the first leads, the power bar extending between the land connecting bar and the die pad.

9. The leadframe of claim 8 wherein:

the die pad has a generally quadrangular configuration;

the first and second leads are segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad; and

a plurality of power bars are included in the leadframe and segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad, the first end of each of the powers bars being integrally connected to one of the land connecting bar and one of the first leads of a corresponding set thereof, with the second end of each of the power bars being integrally connected to one of the first leads of the corresponding set thereof.

10. The leadframe of claim 9 wherein:

the die pad, the first leads, the power bars and the land connecting bar reside on a first plane; and

the second leads reside on a second plane which extends in spaced, generally parallel to the first plane.

11. The leadframe of claim 9 wherein the first end of the power bar is integrally connected to the land connecting bar, and the second end of the power bar is integrally connected to one of the first leads.

12. The leadframe of claim 9 wherein the first end of the power bar is integrally connected to one of the first leads, and the second end of the power bar is integrally connected to one of the first leads.

13. The leadframe of claim 9 further comprising a plurality a support bars connected to and extending between the die pad and the land connecting bar.

14. A leadframe for a semiconductor package, comprising:

a generally planar die pad defining multiple peripheral edge segments;

a plurality of land connecting bars at least partially circumventing the die pad;

a dambar at least partially circumventing the land connecting bars;

a plurality of first leads integrally connected to each of the land connecting bars and extending inwardly toward the die pad;

a plurality of second leads integrally connected to the dambar, each of the second leads having an inner portion which extends inwardly from the dambar toward a respective one of the land connecting bars, and an outer portion which extends outwardly from the dambar; and

at least one primary power bar integrally connected to at least one of the land connecting bars and extending between at least one of the land connecting bars and the inner portions of at least some of the second leads.

15. The leadframe of claim 14 further comprising at least one secondary power bar having a first end integrally connected to one of the first leads, and a second end integrally connected to one of the first leads, the secondary power bar extending between one of the land connecting bars and the die pad.

16. The leadframe of claim 14 further comprising at least one secondary power bar integrally connected to the inner portions of at least some of the second leads, the secondary power bar extending between at least one of the land connecting bars and the inner portions of at least some of the second leads.

17. The leadframe of claim 16 wherein the secondary power bar comprises at least one lead extension portion which extends between an adjacent pair of the inner portions of the second leads.

18. The leadframe of claim 16 wherein the secondary power bar comprises at least a first region which is of a first width, and a second region which is of a second width less than the first width.

19. The leadframe of claim 16 wherein:

the die pad, the first leads and the connecting bars reside on a first plane;

the primary power bar resides on a second plane;

the secondary power bar and the second leads reside on a third plane; and

the first, second and third planes extend in spaced, generally parallel to each other, with the second plane being disposed between the first and third planes.

20. The leadframe of claim 14 wherein:

the die pad has a generally quadrangular configuration;

the first and second leads and the land connecting bars are segregated into at least four sets which each extend along a respective one of the peripheral edge segments of the die pad; and

a plurality of primary power bars are included in the leadframe and each extend along at least one of the land connecting bars.

21. The leadframe of claim 20 further comprising at least one secondary power bar integrally connected to at least two of the first leads, the secondary power bar extending between one of the land connecting bars and the die pad.