Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
First Claim
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1. An organic electronic integrated circuit comprising:
- at least two continuous multi-layered barrier layers exhibiting no openings therethrough,each of said at least two barrier layers comprising three sublayers,each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light,said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film,a first of said barrier layers forming a substrate;
first and second electrical contacts on the substrate;
a plurality of electronic components on the substrate,at least a portion of said electronic components comprising organic material;
a plurality of interconnections, said plurality of electronic components being electrically interconnected by said interconnections to form a circuit,said circuit being coplanar with and ohmically connected to said first and second electrical contacts on the substrate,at least a second of said barrier layers formed on the substrate such that said circuit is completely enclosed by and protected against said ambient environmental influence by said at least two barrier layers; and
said first and second electrical contacts being external said at least second barrier layer.
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Abstract
An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.
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Citations
26 Claims
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1. An organic electronic integrated circuit comprising:
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at least two continuous multi-layered barrier layers exhibiting no openings therethrough, each of said at least two barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film, a first of said barrier layers forming a substrate; first and second electrical contacts on the substrate; a plurality of electronic components on the substrate, at least a portion of said electronic components comprising organic material; a plurality of interconnections, said plurality of electronic components being electrically interconnected by said interconnections to form a circuit, said circuit being coplanar with and ohmically connected to said first and second electrical contacts on the substrate, at least a second of said barrier layers formed on the substrate such that said circuit is completely enclosed by and protected against said ambient environmental influence by said at least two barrier layers; and said first and second electrical contacts being external said at least second barrier layer. - View Dependent Claims (2, 4, 10, 11, 12, 17, 18, 21)
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3. An electronic circuit comprising:
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at least two continuous multi-layered barrier layers exhibiting no openings therethrough, each of said at least two barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film, one of said barrier layers forming a substrate; first and second electrical contacts on the substrate; at least one electronic component on the substrate, said at least one electronic component forms an organic field-effect transistor including source and drain electrodes above a first of said at least two continuous multi-layered barrier layers and embedded in a semiconducting layer with an adjoining layer of uncrosslinked polymer insulating material, a gate electrode embedded in the uncrosslinked polymer layer of insulating material, followed by the second of said continuous multi-layered barrier layers; at least one interconnection electrically connected to said at least one electronic component to form a circuit, said circuit being coplanar with and ohmically connected to said first and second electrical contacts on the substrate, at least a second of said barrier layers formed on the substrate such that said circuit is completely enclosed by and protected against said ambient environmental influence by said at least two barrier layers; and said first and second electrical contacts being external said at least second barrier layer. - View Dependent Claims (5, 6, 7, 8, 9, 13)
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14. A method for producing an electronic circuit having electronic components comprised of organic material comprising:
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forming a first continuous multi-layered barrier layer exhibiting no openings therethrough, arranging a plurality of electronic components of an electronic integrated circuit on the first barrier layer; forming first and second electrical contacts on the first barrier layer coplanar with the electronic components; forming a plurality of coplanar electrical conductor tracks on the first barrier layer, thereby interconnecting the plurality of electric components to each other and to the contacts through said tracks; forming at least a second continuous multi-layered barrier layer exhibiting no openings therethrough, applying said at least a second barrier layer onto said first barrier layer over only a first portion of the interconnected electronic components and their interconnecting conductor tracks, thereby defining a second portion of the interconnected electronic components external the second barrier layer, each of said barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film, said first portion of electronic components being completely enclosed by and protected against said ambient environmental influence by said at least two barrier layers, said first and second electrical contacts being external said at least second barrier layer, said second portion of the interconnected electronic components extending beyond the region between said first and second barrier layers. - View Dependent Claims (15, 16)
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19. A method for producing an electronic circuit having electronic components comprised of organic material comprising:
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constructing a first continuous multi-layered barrier layer exhibiting no openings therethrough; arranging electronic components to form an integrated electronic sensor circuit on said first barrier layer; connecting electrical conductor tracks to electrical contacts on said first barrier layer and coupled to said electronic components to form said circuit; applying a second continuous multi-layered barrier layer exhibiting no openings therethrough over the electronic components and their circuit, said second barrier layer cooperating with the first barrier layer to protect the components and their circuit against light and external environmental atmospheric influences including at least one of air or liquid; each of said barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film, forming first and second contacts on said first barrier layer external the region between said first and second barrier layers and ohmically connecting said contacts to said circuit; forming an antenna having first and second electrical terminals on said first barrier layer external the region between said first and second barrier layers for connection to respective corresponding ones of said first and second contacts; and interconnecting the first and second contacts respectively with the first and second terminals by folding over a portion of the first barrier to interconnect at least one of said first and second contacts with a corresponding terminal. - View Dependent Claims (20)
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22. An electronic circuit comprising:
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at least two continuous multi-layered barrier layers exhibiting no openings therethrough, each of said at least two barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film; a first component comprising at least one electronic component; a second component comprising at least one electronic component; a further component comprising at least one electronic component; interconnections electrically connecting said first component to said second component and to said further component; said first component comprising organic material; said first and said second components both being arranged between said at least two barrier layers; wherein said at least two barrier layers protect said first component, said second component and said interconnections against said ambient environmental influence; at least one conductor forming a portion of said interconnections, said conductor being electrically connected to and coplanar with said first and second components, said conductor being electrically connected to said further component, said further component and at least a portion of said conductor being external the region between the at least two barrier layers; two electrical contacts external the region between the barrier layers and coplanar with the electronic component and the interconnections; and an antenna external the region between the at least two barrier layers ohmically connected to the two electrical contacts.
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23. An electronic circuit comprising:
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a plurality of electronic components, at least one of said components comprises organic material; interconnections electrically interconnecting said electronic components; an output of said electronic components, said output for outputting an electrical current signal; at least two continuous multi-layered barrier layers exhibiting no openings therethrough, each of said at least two barrier layers comprising three sublayers, each of said three sublayers forming a continuous barrier to ambient environmental influences, said ambient environmental influences including at least one of air, liquid or light, said three sublayers being a lowermost sub layer of plastic film, a second sublayer of metallic film, and a third sublayer of plastic film; said electronic components and said interconnections being arranged between said at least two barrier layers; wherein said at least two barrier layers cooperate to protect said plurality of components and said interconnections from said ambient environmental influence; a pair of electrical contacts external the region between said at least two barrier layers, said pair of electrical contacts being coplanar with the electronic components; and an electrical device on one of said barrier layers and electrically coupled to said contacts, said electrical device for receiving said electrical current signal from said output of said electronic components. - View Dependent Claims (24, 25, 26)
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Specification