Chuck for holding a device under test

• US 7,876,115 B2
• Filed: 02/17/2009
• Issued: 01/25/2011
• Est. Priority Date: 05/23/2003
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Stewart, Craig, Spencer, Jeff, Lord, Anthony, Lesher, Tim, Burcham, Terry, Dunklee, John, Newton, David, Jones, Rod, McCann, Peter
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Chan; Emily Y
• Application Number:
  US12/378,648
• Publication Number:
  US 20090153167A1
• Time in Patent Office: 707 Days
• Field of Search: 324754-765
• US Class Current: 324/754.07
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Claims

1. A probe station for probing a device under test comprising:

(a) a chuck having an upper surface suitable to support said device under test;

(b) a first conductive element defining a first signal path to said upper surface of said chuck, said signal path electrically isolated from said upper surface of said chuck, said conductive element in electrical contact with said device under test when said device under test is at least partially supported by said upper surface of said chuck, said signal path extending through at least a portion of said chuck; and

(c) a second conductive element defining a second signal path, which is a test signal path, electrically isolated from said first signal path, free of direct electrical contact with said upper surface of said chuck and in electrical contact with said device under test when said device under test is at least partially supported by said upper surface of said chuck, said second signal path not extending through at least a portion of said chuck.

2. The chuck if claim 1 where said first signal path is a sense signal path.

3. A probe station for probing a device under test having a probing surface, said probe station comprising:

(a) a chuck having an upper surface suitable to support said device under test;

(b) a first conductive element defining a first signal path to said upper surface of said chuck, said signal path electrically isolated from said upper surface of said chuck, said conductive element in electrical contact with said device under test when said device under test is at least partially supported by said upper surface of said chuck, said signal path extending through at least a portion of said chuck; and

(c) a second conductive element defining a second signal path, which is a test signal path, electrically isolated from said first signal path, free of direct electrical contact with said upper surface of said chuck and in electrical contact with said device under test when said device under test is at least partially supported by said upper surface of said chuck, said second signal path not extending through at least a portion of said chuck.

4. The chuck of claim 3 where said first signal path is a sense signal path.