Structure for a phase locked loop with adjustable voltage based on temperature
First Claim
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1. A design structure embodied in a non-transitory machine readable medium for designing, manufacturing, or testing an integrated circuit, wherein when the design structure is processed by a computer processor, the design structure causes the computer processor to produce a logically equivalent functional representation of the integrated circuit, the design structure comprising:
- one or more first design structure elements representing one or more thermal sensors provided on an integrated circuit device;
a second design structure element representing a thermal monitoring mechanism coupled to the one or more thermal sensors; and
a third design structure element representing a phase locked loop (PLL) circuit coupled to the thermal monitoring mechanism, wherein the one or more thermal sensors are configured for use in controlling an operation of the integrated circuit device and an operation of the PLL circuit, and wherein the design structure is configured such that;
an operational temperature of the integrated circuit device associated with the PLL circuit is sensed with the one or more thermal sensors provided on the integrated circuit device,an operation of the PLL circuit is controlled based on the operational temperature sensed by the one or more thermal sensors; and
a compensation voltage input signal to a voltage controlled oscillator of the PLL circuit is generated based on the operational temperature, wherein the compensation voltage input signal modifies a lock frequency range of the PLL circuit, wherein the design structure is further configured such that;
the one or more thermal sensors generate at least one voltage based on the operational temperature of the integrated circuit device;
the at least one voltage is provided, by the one or more thermal sensors, to the thermal monitoring mechanism;
the thermal monitoring mechanism generates at least one digital value based on the at least one voltage; and
the thermal monitoring mechanism generates an operational temperaturevalue of the integrated circuit device based on the at least one digital value, wherein the one or more thermal sensors comprise a plurality of thermal sensors and the at least one voltage comprises a plurality of voltages, and wherein the design structure is further configured such that converting the plurality of voltages to at least one digital value comprises;
converting each voltage to a corresponding digital value;
generating an average digital value; and
generating the operational temperature of the integrated circuit device based on the average digital value.
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Abstract
A design structure for an apparatus for utilizing a single set of one or more thermal sensors, e.g., thermal diodes, provided on the integrated circuit device, chip, etc., to control the operation of the integrated circuit device, associated cooling system, and high-frequency PLLs, is provided. By utilizing a single set of thermal sensors to provide multiple functions, e.g., controlling the operation of the integrated circuit device, the cooling system, and the PLLs, silicon real-estate usage is reduced through combining circuitry functionality. Moreover, the integrated circuit device yield is improved by reducing circuitry complexity and increasing PLL robustness to temperature. Furthermore, the PLL circuitry operating range is improved by compensating for temperature.
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Citations
19 Claims
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1. A design structure embodied in a non-transitory machine readable medium for designing, manufacturing, or testing an integrated circuit, wherein when the design structure is processed by a computer processor, the design structure causes the computer processor to produce a logically equivalent functional representation of the integrated circuit, the design structure comprising:
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one or more first design structure elements representing one or more thermal sensors provided on an integrated circuit device; a second design structure element representing a thermal monitoring mechanism coupled to the one or more thermal sensors; and a third design structure element representing a phase locked loop (PLL) circuit coupled to the thermal monitoring mechanism, wherein the one or more thermal sensors are configured for use in controlling an operation of the integrated circuit device and an operation of the PLL circuit, and wherein the design structure is configured such that; an operational temperature of the integrated circuit device associated with the PLL circuit is sensed with the one or more thermal sensors provided on the integrated circuit device, an operation of the PLL circuit is controlled based on the operational temperature sensed by the one or more thermal sensors; and a compensation voltage input signal to a voltage controlled oscillator of the PLL circuit is generated based on the operational temperature, wherein the compensation voltage input signal modifies a lock frequency range of the PLL circuit, wherein the design structure is further configured such that; the one or more thermal sensors generate at least one voltage based on the operational temperature of the integrated circuit device; the at least one voltage is provided, by the one or more thermal sensors, to the thermal monitoring mechanism; the thermal monitoring mechanism generates at least one digital value based on the at least one voltage; and the thermal monitoring mechanism generates an operational temperature value of the integrated circuit device based on the at least one digital value, wherein the one or more thermal sensors comprise a plurality of thermal sensors and the at least one voltage comprises a plurality of voltages, and wherein the design structure is further configured such that converting the plurality of voltages to at least one digital value comprises; converting each voltage to a corresponding digital value; generating an average digital value; and generating the operational temperature of the integrated circuit device based on the average digital value. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A design structure encoded on a non-transitory machine-readable data storage medium, said design structure comprising elements that when processed in a computer-aided design system generates a machine-executable representation of a phase locked loop circuit, wherein said design structure comprises:
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one or more first design structure elements representing one or more thermal sensors provided on an integrated circuit device; a second design structure element representing a thermal monitoring mechanism coupled to the one or more thermal sensors; a third design structure element representing a phase locked loop (PLL) circuit coupled to the thermal monitoring mechanism, wherein the one or more thermal sensors are configured for use in controlling an operation of the integrated circuit device and an operation of the PLL circuit, and wherein the design structure is configured such that; an operational temperature of the integrated circuit device associated with the PLL circuit is sensed with the one or more thermal sensors provided on the integrated circuit device, and an operation of the PLL circuit is controlled based on the operational temperature sensed by the one or more thermal sensors; and a compensation voltage input signal to a voltage controlled oscillator of the PLL circuit is generated based on the operational temperature, wherein the compensation voltage input signal modifies a lock frequency range of the PLL circuit, wherein the design structure is further configured such that; the one or more thermal sensors generate at least one voltage based on the operational temperature of the integrated circuit device; the at least one voltage is provided, by the one or more thermal sensors, to the thermal monitoring mechanism; the thermal monitoring mechanism generates at least one digital value based on the at least one voltage; and the thermal monitoring mechanism generates an operational temperature value of the integrated circuit device based on the at least one digital value, wherein the one or more thermal sensors comprise a plurality of thermal sensors and the at least one voltage comprises a plurality of voltages, and wherein the design structure is further configured such that converting the plurality of voltages to at least one digital value comprises; converting each voltage to a corresponding digital value; generating an average digital value; and generating the operational temperature of the integrated circuit device based on the average digital value. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A hardware description language (HDL) design structure encoded on a non-transitory machine-readable data storage medium, said HDL design structure comprising elements that when processed in a computer-aided design system generates a machine-executable representation of a phase locked loop circuit, wherein said HDL design structure comprises:
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one or more first design structure elements representing one or more thermal sensors provided on an integrated circuit device; a second design structure element representing a thermal monitoring mechanism coupled to the one or more thermal sensors; and a third design structure element representing a phase locked loop (PLL) circuit coupled to the thermal monitoring mechanism, wherein the one or more thermal sensors are configured for use in controlling an operation of the integrated circuit device and an operation of the PLL circuit, and wherein the design structure is configured such that; an operational temperature of the integrated circuit device associated with the PLL circuit is sensed with the one or more thermal sensors provided on the integrated circuit device, an operation of the PLL circuit is controlled based on the operational temperature sensed by the one or more thermal sensors; and a compensation voltage input signal to a voltage controlled oscillator of the PLL circuit is generated based on the operational temperature, wherein the compensation voltage input signal modifies a lock frequency range of the PLL circuit, wherein the design structure is further configured such that; the one or more thermal sensors generate at least one voltage based on the operational temperature of the integrated circuit device; the at least one voltage is provided, by the one or more thermal sensors, to the thermal monitoring mechanism; the thermal monitoring mechanism generates at least one digital value based on the at least one voltage; and the thermal monitoring mechanism generates an operational temperature value of the integrated circuit device based on the at least one digital value, wherein the one or more thermal sensors comprise a plurality of thermal sensors and the at least one voltage comprises a plurality of voltages, and wherein the design structure is further configured such that converting the plurality of voltages to at least one digital value comprises; converting each voltage to a corresponding digital value; generating an average digital value; and generating the operational temperature of the integrated circuit device based on the average digital value. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method, in a computer-aided design system having at least one processor, for generating a functional design model of a duty cycle correction circuit, said method comprising:
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generating, by the at least one processor, a functional computer-simulated representation of one or more thermal sensors provided on an integrated circuit device; generating, by the at least one processor, a functional computer-simulated representation of a thermal monitoring mechanism coupled to the one or more thermal sensors; and generating, by the at least one processor, a functional computer-simulated representation of a phase locked loop (PLL) circuit coupled to the thermal monitoring mechanism, wherein the one or more thermal sensors are configured for use in controlling an operation of the integrated circuit device and an operation of the PLL circuit, and wherein the functional design model is configured such that; an operational temperature of the integrated circuit device associated with the PLL circuit is sensed with the one or more thermal sensors provided on the integrated circuit device, an operation of the PLL circuit is controlled based on the operational temperature sensed by the one or more thermal sensors; and a compensation voltage input signal to a voltage controlled oscillator of the PLL circuit is generated based on the operational temperature, wherein the compensation voltage input signal modifies a lock frequency range of the PLL circuit, wherein the design structure is further configured such that; the one or more thermal sensors generate at least one voltage based on the operational temperature of the integrated circuit device; the at least one voltage is provided, by the one or more thermal sensors, to the thermal monitoring mechanism; the thermal monitoring mechanism generates at least one digital value based on the at least one voltage; and the thermal monitoring mechanism generates an operational temperature value of the integrated circuit device based on the at least one digital value, wherein the one or more thermal sensors comprise a plurality of thermal sensors and the at least one voltage comprises a plurality of voltages, and wherein the design structure is further configured such that converting the plurality of voltages to at least one digital value comprises; converting each voltage to a corresponding digital value; generating an average digital value; and generating the operational temperature of the integrated circuit device based on the average digital value.
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Specification
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Current AssigneeGlobalFoundries, Inc.
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Original AssigneeInternational Business Machines Corporation
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InventorsChadwick, Nathaniel R., Peterson, Kirk D., Qi, Jieming, Hailu, Eskinder, Boerstler, David W.
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Primary Examiner(s)Schechter; Andrew
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Assistant Examiner(s)O MALLEY, MARY CATHERINE
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Application NumberUS12/128,654Publication NumberTime in Patent Office971 DaysField of Search702 64- 65, 702/99, 702/104, 702/130, 702/132, 700/295, 700299-300, 374/1, 374100-101, 331/66, 331/176US Class Current702/132CPC Class CodesH03L 1/022 by indirect stabilisation, ...H03L 1/04 Constructional details for ...H03L 7/0995 the oscillator comprising a...
