Probe arrays and method for making
First Claim
1. A method for bonding a first electric component to a second electric component, comprising:
- forming a plurality of solder bumps on the first electric component, wherein the solder bumps are surrounded, at least in part by rings of a retention material;
bringing the solder bumps on the first electric component into contact with bonding locations on the second electric component;
heating the solder bumps to cause melting and then cooling the melted solder to bond the first and second electric components together, wherein the separation between the first and second components is set larger than would have been achieved in similar circumstances in absence of the rings of the retention material,wherein one of the electric components comprises a plurality of compliant spring probes.
1 Assignment
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Accused Products
Abstract
Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
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Citations
17 Claims
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1. A method for bonding a first electric component to a second electric component, comprising:
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forming a plurality of solder bumps on the first electric component, wherein the solder bumps are surrounded, at least in part by rings of a retention material; bringing the solder bumps on the first electric component into contact with bonding locations on the second electric component; heating the solder bumps to cause melting and then cooling the melted solder to bond the first and second electric components together, wherein the separation between the first and second components is set larger than would have been achieved in similar circumstances in absence of the rings of the retention material, wherein one of the electric components comprises a plurality of compliant spring probes. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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2. A method for bonding a first electric component to a second electric component, comprising:
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forming a plurality of solder bumps on the first electric component, wherein the solder bumps are surrounded, at least in part by rings of a retention material; reflowing the solder bumps such that the height of the reflowed solder is greater than it would be in absence of the rings of retention material; bringing the reflowed solder bumps on the first component into contact with bonding locations on a second electric component; and heating the reflowed solder bumps to cause melting and then cooling the reflowed solder bump to bond the first and second components together. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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Specification