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Thin film etching method and semiconductor device fabrication using same

  • US 7,879,732 B2
  • Filed: 12/18/2007
  • Issued: 02/01/2011
  • Est. Priority Date: 12/18/2007
  • Status: Expired due to Fees
First Claim
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1. A method for etching a thin film, the method comprising:

  • providing a substrate having a thin film layer thereon;

    etching the thin film layer on the substrate, while monitoring the removal of an endpoint detection layer located remotely from the substrate; and

    stopping the etching when a predetermined amount of the endpoint detection layer has been removed.

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