RFID interposer with impedance matching
First Claim
1. A radio frequency identification device (RFID) interposer comprising:
- a dielectric substrate;
electrically conductive material on a major surface of the substrate;
wherein the electrically conductive material includes an impedance matching structure;
chip bond pads for receiving and electrically coupling one or more chips to the electrically conductive material and antenna bond pads for electrically coupling the electrically conductive material to an antenna;
and wherein the impedance matching structure includes a shunt electrically coupling the antenna bond pads together.
2 Assignments
0 Petitions
Accused Products
Abstract
An RFID interposer has conductive material that includes an impedance matching structure. The impedance matching structure aids in matching impedance between a chip that is to be mounted to the interposer, and an antenna that the interposer is to be coupled to. The impedance matching structures may allow different chips, with slightly different electrical characteristics, to be impedance matched to the same antenna configuration, using the same type of interposer. The impedance matching structure may have any of a variety of configurations in the electrically conductive material of the interposer. The structure may be parts of the chip mounting bond pads, may be part of the conductive electrical connection between the chip bond pads and antenna bond pads, may be part of connections between the chip bond pads and the antenna bond pads, and/or may be only indirectly electrically coupled to the antenna bond pads (such as by capacitive coupling).
95 Citations
16 Claims
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1. A radio frequency identification device (RFID) interposer comprising:
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a dielectric substrate; electrically conductive material on a major surface of the substrate; wherein the electrically conductive material includes an impedance matching structure; chip bond pads for receiving and electrically coupling one or more chips to the electrically conductive material and antenna bond pads for electrically coupling the electrically conductive material to an antenna; and wherein the impedance matching structure includes a shunt electrically coupling the antenna bond pads together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of making an RFID device, the method comprising:
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patterning an electrically conductive material having an impedance matching structure with an inductor shunt; coupling an RFID chip having chip bond pads for receiving and electrically coupling the RFID chip to an RFID interposer with the impedance matching structure, and coupling the RFID interposer to an antenna. - View Dependent Claims (14)
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15. A radio frequency identification (RFID) device comprising:
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a first substrate having a first face and a second face; an antenna on one of the faces; a second substrate attached to the first substrate; chip bond pads for receiving and electrically coupling one or more chips to the second substrate; an impedance matching structure on the second substrate; wherein the impedance matching structure is electrically coupled to the antenna and has electrical characteristics that change depending upon where the chip is coupled to the chip bond pads.
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16. An RFID device comprising:
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a package having an antenna on a surface of the package; and an interposer that includes; a substrate; an electrically conductive material on a major surface of the substrate, the electrically conductive material including an impedance matching structure that includes a shunt; chip bond pads for receiving and electrically coupling one or more chips to the substrate; antenna bond pads for electrically coupling the electrically conductive material to an antenna; and wherein the impedance matching structure is coupled to the antenna.
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Specification