Method and system for a phased array antenna embedded in an integrated circuit package

• US 7,880,677 B2
• Filed: 12/12/2007
• Issued: 02/01/2011
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Primary Examiner(s): Le; HoangAnh T
• Application Number:
  US11/954,822
• Publication Number:
  US 20090153428A1
• Time in Patent Office: 1,147 Days
• Field of Search: 343/700.MS, 343/702, 343/803, 343/810
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/0093 : Monolithic arrays
• CPC Class Codes: H01Q 21/062 : using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 3/36 : with variable phase-shifters
• CPC Class Codes: H01Q 9/265 : Open ring dipoles; Circular dipoles

Abstract

Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).

Claims

1. A method for signal processing, the method comprising:

transmitting and/or receiving signals via a phased array antenna embedded in a multi-layer integrated circuit package bonded to an integrated circuit, wherein said integrated circuit enables said transmitting and/or receiving by altering phasing of said signals.

2. The method according to claim 1, wherein said integrated circuit enabled to perform said transmitting and/or receiving is bonded to said multi-layer integrated circuit package via one or more solder balls.

3. The method according to claim 2, wherein said integrated circuit communicates a reference signal and/or one or more phase shifted versions of said reference signal to said phased array antenna.

4. The method according to claim 1, wherein one or more phase shifters are embedded in said multi-layer package.

5. The method according to claim 4, comprising controlling a phase shift of said one or more phase shifters via one or more control signals from an integrated circuit bonded to said multi-layer integrated circuit package.

6. The method according to claim 4, wherein said one or more phase shifters comprise planar transmission lines.

7. The method according to claim 1, wherein said phased array antenna comprises a plurality of antenna elements and each antenna element comprises an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion.

8. The method according to claim 7, wherein said radiating portion is a folded dipole structure.

9. The method according to claim 1, wherein said phased array antenna comprises planar transmission lines.

10. The method according to claim 1, wherein said multi-layer integrated circuit package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.

11. A system for signal processing the system comprising:

a phased array antenna embedded in a multi-layer integrated circuit package bonded to an integrated circuit, wherein said integrated circuit enables transmitting and/or receiving of a signal via said phased array antenna by altering phasing of said signals.

12. The system according to claim 11, wherein said integrated circuit is bonded to said multi-layer integrated circuit package via one or more solder balls.

13. The system according to claim 12, wherein said integrated circuit communicates a reference signal and/or one or more phase shifted versions of said reference signal to said phased array antenna.

14. The system according to claim 11, wherein one or more phase shifters are embedded in said multi-layer package.

15. The system according to claim 14, wherein a phase shift of said one or more phase shifters is controlled via one or more control signals from an integrated circuit bonded to said multi-layer integrated circuit package.

16. The system according to claim 14, wherein said one or more phase shifters comprise planar transmission lines.

17. The system according to claim 11, wherein said phased array antenna comprises a plurality of antenna elements and each antenna element comprises an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion.

18. The system according to claim 17, wherein said radiating portion is a folded dipole structure.

19. The system according to claim 11, wherein said phased array antenna comprises planar transmission lines.

20. The system according to claim 11, wherein said multi-layer integrated circuit package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.