Feedthrough capacitor mounted structure

• US 7,881,040 B2
• Filed: 10/14/2008
• Issued: 02/01/2011
• Est. Priority Date: 11/29/2007
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Togashi, Masaaki
• Primary Examiner(s): Ha; Nguyen T
• Application Number:
  US12/250,870
• Publication Number:
  US 20090141421A1
• Time in Patent Office: 840 Days
• Field of Search: 361/302, 361303-305, 361/321.1, 361/321.2, 361/306.1, 361/306.3, 361311-313, 361/301.1, 361/301.4, 333182-185
• US Class Current: 361/302
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction. The pair of first terminal electrodes are connected to the respective first land electrodes corresponding to the pair of adjacent first via holes. The second terminal electrode is connected to the second land electrode.

Claims

1. A feedthrough capacitor mounted structure in which a feedthrough capacitor is mounted on a mounting surface of a substrate,

wherein the substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and comprises a plurality of first via holes extending from the mounting surface to the first conductor portion, a plurality of second via holes extending from the mounting surface to the second conductor portion, a plurality of first land electrodes formed at respective positions corresponding to the first via holes on the mounting surface and connected to the corresponding first via holes, and a second land electrode formed on the mounting surface and connected to the second via holes in an isolated state from the first land electrodes,

wherein the first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction,

wherein the feedthrough capacitor comprises an element body having a longitudinal direction, a pair of first terminal electrodes arranged on a pair of first end faces of the element body opposed in the longitudinal direction, and a second terminal electrode arranged on a second end face of the element body perpendicular to the longitudinal direction,

wherein the feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction,

wherein said pair of first terminal electrodes are connected to the respective first land electrodes corresponding to said pair of adjacent first via holes, and

wherein the second terminal electrode is connected to the second land electrode.

2. A feedthrough capacitor mounted structure in which first and second feedthrough capacitors are mounted on a mounting surface of a substrate,

wherein the substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and comprises a plurality of first via holes extending from the mounting surface to the first conductor portion, a plurality of second via holes extending from the mounting surface to the second conductor portion, a plurality of first land electrodes formed at respective positions corresponding to the first via holes on the mounting surface and connected to the corresponding first via holes, and a second land electrode formed on the mounting surface and connected to the second via holes in an isolated state from the first land electrodes,

wherein the first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction,

wherein each of the first and second feedthrough capacitors comprises an element body having a longitudinal direction, a pair of first terminal electrodes arranged on a pair of faces of the element body opposed in the longitudinal direction, and a second terminal electrode arranged on a face of the element body perpendicular to the longitudinal direction,

wherein each of the first and second feedthrough capacitors, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction,

wherein said pair of first terminal electrodes are connected to the respective first land electrodes corresponding to said pair of adjacent first via holes,

wherein the second terminal electrode is connected to the second land electrode,

wherein one first via hole out of the pair of first via holes between which the first feedthrough capacitor is located, is the same as one first via hole out of the pair of first via holes between which the second feedthrough capacitor is located, and

wherein the other first via hole out of the pair of first via holes between which the first feedthrough capacitor is located, is opposed to the other first via hole out of the pair of first via holes between which the second feedthrough capacitor is located, with the second via hole in between.

3. A feedthrough capacitor mounted structure in which first to fourth feedthrough capacitors are mounted on a mounting surface of a substrate,

wherein the substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and comprises a plurality of first via holes extending from the mounting surface to the first conductor portion, a plurality of second via holes extending from the mounting surface to the second conductor portion, a plurality of first land electrodes formed at respective positions corresponding to the first via holes on the mounting surface and connected to the corresponding first via holes, and a second land electrode formed on the mounting surface and connected to the second via holes in an isolated state from the first land electrodes,

wherein the first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction,

wherein each of the first to fourth feedthrough capacitors comprises an element body having a longitudinal direction, a pair of first terminal electrodes arranged on a pair of faces of the element body opposed in the longitudinal direction, and a second terminal electrode arranged on a face of the element body perpendicular to the longitudinal direction,

wherein each of the first to fourth feedthrough capacitors, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction,

wherein said pair of first terminal electrodes are connected to the respective first land electrodes corresponding to said pair of adjacent first via holes,

wherein the second terminal electrode is connected to the second land electrode,

wherein one first via hole out of the pair of first via holes between which the first feedthrough capacitor is located, is the same as one first via hole out of the pair of first via holes between which the second feedthrough capacitor is located,

wherein the other first via hole out of the pair of first via holes between which the first feedthrough capacitor is located, is opposed to the other first via hole out of the pair of first via holes between which the second feedthrough capacitor is located, with the second via hole in between, and is the same as one first via hole out of the pair of first via holes between which the third feedthrough capacitor is located,

wherein the other first via hole out of the pair of first via holes between which the third feedthrough capacitor is located, is opposed to the one first via hole out of the pair of first via holes between which the first feedthrough capacitor is located, with the second via hole in between, and is the same as one first via hole out of the pair of first via holes between which the fourth feedthrough capacitor is located, and

wherein the other first via hole out of the pair of first via holes between which the fourth feedthrough capacitor is located, is the same as the other first via hole out of the pair of first via holes between which the second feedthrough capacitor is located.