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Use of a titanium-copper-nickel-based alloy

  • US 7,883,744 B2
  • Filed: 10/21/2005
  • Issued: 02/08/2011
  • Est. Priority Date: 11/05/2004
  • Status: Active Grant
First Claim
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1. A method for forming a resistive thin film on a polymer substrate, comprising applying to said polymer substrate a titanium-copper-nickel based alloy comprising 50 to 80% by weight of titanium, 10 to 25% by weight of copper and 10 to 25% by weight of nickel, wherein the thickness of the thin film is between about 100 and 160 nanometres and whereby said resistive thin film exhibits electrical resistivity at a voltage between 12 volts and 48 volts.

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