Gate structure in a trench region of a semiconductor device and method for manufacturing the same
First Claim
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1. A method for manufacturing a semiconductor device, the method comprising the steps of:
- forming first and second drift regions in a semiconductor substrate;
forming an oxide layer on the substrate such that the oxide layer partially overlaps the first and second drift regions;
forming a trench between the first and second drift regions;
forming an oxide spacer on sidewalls of the trench;
forming an insulating layer at a bottom of the trench;
forming a gate in the trench and on the oxide layer;
forming a spacer on sidewalls of the gate; and
forming a source in one of the first and second drift regions and a drain in the other of the first and second drift regions.
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Abstract
Disclosed are a gate structure in a trench region of a semiconductor device and a method for manufacturing the same. The semiconductor device includes a pair of drift regions formed in a semiconductor substrate; a trench region formed between the pair of drift regions; an oxide layer spacer on sidewalls of the trench region; a gate formed in the trench region; and a source and a drain formed in the pair of the drift regions, respectively.
13 Citations
17 Claims
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1. A method for manufacturing a semiconductor device, the method comprising the steps of:
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forming first and second drift regions in a semiconductor substrate; forming an oxide layer on the substrate such that the oxide layer partially overlaps the first and second drift regions; forming a trench between the first and second drift regions; forming an oxide spacer on sidewalls of the trench; forming an insulating layer at a bottom of the trench; forming a gate in the trench and on the oxide layer; forming a spacer on sidewalls of the gate; and forming a source in one of the first and second drift regions and a drain in the other of the first and second drift regions. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a semiconductor device, the method comprising the steps of:
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forming first and second drift regions in a semiconductor substrate; forming an oxide layer on the substrate such that the oxide layer overlaps with each of the first and second drift regions; forming a nitride layer on the substrate; forming a trench between the first and second drift regions; forming an oxide spacer on sidewalls of the trench; forming an insulating layer at a bottom of the trench; removing the nitride layer; forming a gate in the trench region and at least partially on the oxide layer; and forming a source in one of the first and second drift regions and a drain in the other of the first and second drift regions. - View Dependent Claims (8, 9)
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10. A method for manufacturing a semiconductor device, the method comprising the steps of:
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forming first and second drift regions in a semiconductor substrate; forming a mask pattern on the substrate; etching the substrate to a predetermined depth; depositing the oxide layer over an entire surface of the semiconductor substrate such that the oxide layer partially overlaps the first and second drift regions; planarizing the oxide layer; forming a trench between the first and second drift regions; forming an oxide spacer on sidewalls of the trench; forming an insulating layer at a bottom of the trench; forming a gate in the trench and on the oxide layer; and forming a source in one of the first and second drift regions and a drain in the other of the first and second drift regions. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification