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High density interconnect system having rapid fabrication cycle

  • US 7,884,634 B2
  • Filed: 01/15/2009
  • Issued: 02/08/2011
  • Est. Priority Date: 05/27/1999
  • Status: Expired due to Fees
First Claim
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1. An apparatus, comprising:

  • a probe card interface assembly, comprisinga motherboard substrate having a lower surface, an upper surface opposite the lower surface, and a plurality of electrical conductors extending from the upper surface to the lower surface, wherein the electrical conductors form a pattern of electrical connections on the lower surface of the motherboard substrate, anda probe chip mounting system affixed to the motherboard comprisingat least one substrate and having a motherboard interface surface and a probe chip assembly mounting surface opposite the motherboard interface surface, anda plurality of electrical conductors corresponding to the pattern of electrical connections on the bottom surface of said motherboard substrate, the electrical conductors extending from the motherboard interface surface to the probe chip assembly mounting surface; and

    a probe chip assembly mounted to the probe card interface assembly, the probe chip assembly comprising a probe chip substrate having a probing surface and a mounting surface opposite the probing surface, and a plurality of probe springs extending from said probing surface for providing electrical connections to at least one integrated circuit device on a semiconductor wafer, said probe springs having electrical connections to a plurality of standard connections on the mounting surface, said standard connections corresponding to said pattern of electrical connections on said bottom surface of said motherboard substrate;

    wherein a probe chip assembly mounting reference plane is defined by at least three points between the lower surface of the motherboard substrate and the semiconductor wafer, wherein the probe chip assembly mounting reference plane is adjustable to be coplanar to the probe chip assembly mounting surface of the probe card interface assembly based on measured data of the probe card interface assembly.

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