×

Microelectromechanical sensor having multiple full-scale and sensitivity values

  • US 7,886,601 B2
  • Filed: 10/26/2007
  • Issued: 02/15/2011
  • Est. Priority Date: 10/27/2006
  • Status: Active Grant
First Claim
Patent Images

1. A microelectromechanical sensing structure comprising:

  • a mobile element adapted to be displaced as a function of a quantity to be detected;

    first fixed elements capacitively coupled to said mobile element and configured to implement with said mobile element to provide first detection conditions of said quantity; and

    second fixed elements capacitively coupled to said mobile element and configured to implement with said mobile element to provide second detection conditions of said quantity, wherein said second detection conditions are different from said first detection conditions with respect to a full-scale value and a sensitivity value associated with detection of said quantity, wherein a total number of all of said first fixed elements is higher than a total number of all of said second fixed elements, and a lower value of said full scale and a higher value of said sensitivity is associated with said first fixed elements.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×