Heat spreading circuit assembly
First Claim
1. A circuit assembly comprising a substrate which comprises a dielectric layer, a heat spreader layer which comprises at least one sheet of compressed particles of exfoliated graphite having two major surfaces, wherein the heat spreader layer is located at a first surface of the substrate, wherein the second surface of the substrate has a circuit thereon and an LED having an LED mounting plane mounted on the circuit, and a thermal pathway in thermal connection with both the heat spreader layer and the LED, wherein the thermal pathway has a length such that it extends through the substrate and at least substantially through the heat spreader layer and further wherein the surface area of the major surface of the heat spreader layer which is located at the first surface of the substrate is greater than the surface area of the surface of the substrate at which the heat spreader layer is located such that the heat spreader layer extends perpendicular to the LED mounting plane.
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Accused Products
Abstract
A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.
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Citations
36 Claims
- 1. A circuit assembly comprising a substrate which comprises a dielectric layer, a heat spreader layer which comprises at least one sheet of compressed particles of exfoliated graphite having two major surfaces, wherein the heat spreader layer is located at a first surface of the substrate, wherein the second surface of the substrate has a circuit thereon and an LED having an LED mounting plane mounted on the circuit, and a thermal pathway in thermal connection with both the heat spreader layer and the LED, wherein the thermal pathway has a length such that it extends through the substrate and at least substantially through the heat spreader layer and further wherein the surface area of the major surface of the heat spreader layer which is located at the first surface of the substrate is greater than the surface area of the surface of the substrate at which the heat spreader layer is located such that the heat spreader layer extends perpendicular to the LED mounting plane.
- 18. A circuit assembly comprising a substrate which comprises a dielectric layer having two surfaces, a heat spreader layer comprising at least one sheet of compressed particles of exfoliated graphite having two major surfaces, wherein the heat spreader layer is positioned adjacent a first surface of the substrate, a circuit located at a second surface of the substrate with an LED having an LED mounting plane mounted on the circuit, and a thermal pathway which extends through the substrate and is in thermal connection with both the heat spreader layer and the LED, wherein the surface area of one of the major surfaces of the heat spreader layer is greater than the surface area of the first surface of the substrate such that the heat spreader layer extends perpendicular to the LED mounting plane and beyond the second surface of the substrate.
- 24. A flex circuit comprising a substrate which comprises a flexible dielectric layer, a heat spreader layer comprising at least one sheet of compressed particles of exfoliated graphite having two major surfaces, wherein the heat spreader layer is located at a first surface of the substrate, a circuit located at a second surface of the substrate with an LED having an LED mounting plane mounted on the circuit, and a thermal pathway in thermal connection with both the heat spreader layer and the LED, wherein the thermal pathway has a length at least equal to the thickness of the substrate and heat spreader layer and further wherein the surface area of one of the major surfaces of the heat spreader layer is greater than the surface area of the surface of the substrate at which the heat spreader layer is located such that the heat spreader layer extends perpendicular to the LED mounting plane.
Specification