Inkjet printhead with nozzle layer defining etchant holes
First Claim
1. An inkjet printhead for an inkjet printer, said inkjet printhead comprising:
- a wafer substrate defining an ink supply channel therethrough;
side wall portions extending away from one surface of the wafer substrate;
a nozzle layer supported on the side wall portions and extending parallel to said one surface of the wafer substrate, the nozzle layer and the side wall portions defining an array of nozzle chambers for receiving ink, said nozzle layer defining ink ejection ports and etchant holes, the etchant holes being of sufficient diameter to retain ink in the nozzle chamber by surface tension; and
a plurality of thermal actuators cantilevered on the wafer substrate;
one of the thermal actuator being positioned in each of the nozzle chambers respectively such that the thermal actuator partitions the nozzle chamber, the thermal actuator having a heater layer which produces thermal expansion of said thermal actuator upon activation.
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Accused Products
Abstract
The current invention provides for an inkjet printhead for an inkjet printer. The inkjet printhead includes a wafer substrate defining an ink supply channel. Side wall portions extend away from one surface of the wafer substrate, and a nozzle layer supported on the side wall portions and extending parallel to said one surface of the wafer substrate. The nozzle layer and the side wall portions define an array of nozzle chambers for receiving ink. The nozzle layer defines ink ejection ports and etchant holes. The etchant holes are of sufficient diameter to retain ink in the nozzle chamber by surface tension. Each nozzle chamber has a thermal actuators cantilevered on the wafer substrate. The actuator partitions the nozzle chamber and has a heater layer which produces thermal expansion of said actuator upon activation.
65 Citations
7 Claims
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1. An inkjet printhead for an inkjet printer, said inkjet printhead comprising:
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a wafer substrate defining an ink supply channel therethrough; side wall portions extending away from one surface of the wafer substrate; a nozzle layer supported on the side wall portions and extending parallel to said one surface of the wafer substrate, the nozzle layer and the side wall portions defining an array of nozzle chambers for receiving ink, said nozzle layer defining ink ejection ports and etchant holes, the etchant holes being of sufficient diameter to retain ink in the nozzle chamber by surface tension; and a plurality of thermal actuators cantilevered on the wafer substrate;
one of the thermal actuator being positioned in each of the nozzle chambers respectively such that the thermal actuator partitions the nozzle chamber, the thermal actuator having a heater layer which produces thermal expansion of said thermal actuator upon activation. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification