Monitoring or imaging system with interconnect structure for large area sensor array
First Claim
1. An ultrasonic monitoring system comprising a probe unit including:
- an array of transducer cells arranged in rows and columns and formed along a first plane with a first pitch along a first direction;
an integrated circuit including an array of circuit cells formed along a second plane parallel to the first plane, the circuit cells spaced apart along the first direction at a second pitch smaller than the first pitch, a first of the transducer cells vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto, and a second of the transducer cells offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell;
a connection subsystem positioned between the array of transducer cells and the array of circuit cells, configured to form the connection of the first transducer cell to the first circuit cell and to connect the second transducer cell with the second circuit cell; and
an interconnection structure positioned to provide electrical connections between the integrated circuit and processing circuitry.
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Accused Products
Abstract
An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.
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Citations
24 Claims
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1. An ultrasonic monitoring system comprising a probe unit including:
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an array of transducer cells arranged in rows and columns and formed along a first plane with a first pitch along a first direction; an integrated circuit including an array of circuit cells formed along a second plane parallel to the first plane, the circuit cells spaced apart along the first direction at a second pitch smaller than the first pitch, a first of the transducer cells vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto, and a second of the transducer cells offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell; a connection subsystem positioned between the array of transducer cells and the array of circuit cells, configured to form the connection of the first transducer cell to the first circuit cell and to connect the second transducer cell with the second circuit cell; and an interconnection structure positioned to provide electrical connections between the integrated circuit and processing circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification