Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
First Claim
Patent Images
1. A computer-implemented method for identifying an edge of a care area for an array area formed on a wafer, comprising:
- determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area;
determining a threshold from an average of the values for the difference image known to be inside the array area; and
identifying the position that is located closest to the inside of the array area and that has the value greater than the threshold as a position of the edge of the care area, wherein said determining the value, said determining the threshold, and said identifying are performed using a computer system.
1 Assignment
0 Petitions
Accused Products
Abstract
Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
24 Citations
17 Claims
-
1. A computer-implemented method for identifying an edge of a care area for an array area formed on a wafer, comprising:
-
determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area; determining a threshold from an average of the values for the difference image known to be inside the array area; and identifying the position that is located closest to the inside of the array area and that has the value greater than the threshold as a position of the edge of the care area, wherein said determining the value, said determining the threshold, and said identifying are performed using a computer system. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A computer-implemented method for identifying an edge of a care area for an array area formed on a wafer, comprising:
-
determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area; determining if a repeating pattern is formed at each of the positions; determining a threshold from an average of the values for the difference image known to be inside the array area; and identifying the position that is located closest to the inside of the array area, that has the value greater than the threshold, and at which the repeating pattern is formed as a position of the edge of the care area, wherein said determining the value, said determining if the repeating pattern is formed at each of the positions, said determining the threshold, and said identifying are preformed using a computer system. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A system configured to identify an edge of a care area for an array area formed on a wafer, comprising:
-
an inspection subsystem configured to acquire a difference image for the wafer; and a computer subsystem configured to determine a value for the difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area, to determine a threshold from an average of the values for the difference image known to be inside the array area, and to identify the position that is located closest to the inside of the array area and that has the value greater than the threshold as a position of the edge of the care area.
-
Specification